Inventor · disambiguated record
Yong Cheol Chu
Also filed as: CHU YONG CHEOL
2 granted patents·3 pending applications·2 citations·filing 2008–2013
37Inventor score
Top patents by PatentIndex Score
5 records- 0157US10661394B2Metal core solder ball and heat dissipation structure for semiconductor device using the sameDUKSAN HI METAL CO LTD·Filed 2013·Granted May 26, 2020·1 cites·2 claims
- 0254US8221560B2Lead free solder alloyKIM KANG HEE·Filed 2008·Granted Jul 17, 2012·1 cites·6 claims
- 0337US2012228560A1Conductive adhesive, method for manufacturing the same, and electronic device including the sameJANG YONG UN·Filed 2012·Application pending·0 cites
- 0432US2012067629A1Solder adhesive and a production method for the same, and an electronic device comprising the sameJANG YONG UN·Filed 2011·Application pending·0 cites
- 0526US2012309866A1Solder ink and electronic device package using sameJANG YONG UN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →