Inventor · disambiguated record
Yoshikazu Daigo
Also filed as: DAIGO YOSHIKAZU
2 granted patents·2 pending applications·0 citations·filing 2008–2024
24Inventor score
Top patents by PatentIndex Score
4 records- 0157US2024287237A1Thermosetting resin composition, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2024·Application pending·0 cites
- 0256US12319865B2Thermosetting resin composition, cured product, and printed wiring boardTAIYO HOLDINGS CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·21 claims
- 0342US8042976B2White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting deviceTAIYO HOLDINGS CO LTD·Filed 2008·Granted Oct 25, 2011·0 cites·11 claims
- 0440US2009141505A1White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting deviceTAIYO INK MFG CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →