Inventor · disambiguated record
Yoshimi Egawa
Also filed as: EGAWA YOSHIMI
29 granted patents·1 pending application·637 citations·filing 1997–2010
97Inventor score
Files withOKI ELECTRIC IND CO LTD18EGAWA YOSHIMI6OKI SEMICONDUCTOR CO LTD5OKI ELECTRIC INDUCTRY CO LTD1
Top patents by PatentIndex Score
30 records- 0197US8314492B2Semiconductor package and package-on-package semiconductor deviceEGAWA YOSHIMI·Filed 2010·Granted Nov 20, 2012·83 cites·7 claims
- 0297US6777797B2Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bondingOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 17, 2004·138 cites·25 claims
- 0396US6259163B1Bond pad for stress releif between a substrate and an external substrateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 10, 2001·107 cites·9 claims
- 0484US6870249B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 22, 2005·37 cites·19 claims
- 0582US7413925B2Method for fabricating semiconductor packageOKI ELECTRIC INDUCTRY CO LTD·Filed 2006·Granted Aug 19, 2008·14 cites·6 claims
- 0681US6376278B1Methods for making a plurality of flip chip packages with a wafer scale resin sealing stepOKI ELECTRIC IND CO LTD·Filed 2000·Granted Apr 23, 2002·33 cites·16 claims
- 0781US6229215B1Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 1998·Granted May 8, 2001·62 cites·13 claims
- 0880US8138023B2Method for forming laminated structure and method for manufacturing semiconductor device using the method thereofEGAWA YOSHIMI·Filed 2006·Granted Mar 20, 2012·10 cites·18 claims
- 0979US7781880B2Semiconductor packageOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Aug 24, 2010·7 cites·5 claims
- 1074US7898086B2Semiconductor device having a package base with at least one through electrodeOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Mar 1, 2011·6 cites·20 claims
- 1173US7646086B2Semiconductor packageOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jan 12, 2010·5 cites·5 claims
- 1270US6251704B1Method of manufacturing semiconductor devices having solder bumps with reduced cracksOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 26, 2001·25 cites·20 claims
- 1362US8202391B2Camera module and method of manufacturing camera moduleEGAWA YOSHIMI·Filed 2009·Granted Jun 19, 2012·2 cites·6 claims
- 1462US7215031B2Multi chip packageOKI ELECTRIC IND CO LTD·Filed 2004·Granted May 8, 2007·10 cites·26 claims
- 1561US7560302B2Semiconductor device fabricating methodOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Jul 14, 2009·2 cites·5 claims
- 1661US5863815AMethod of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Jan 26, 1999·22 cites·20 claims
- 1760US8143718B2Semiconductor device having stress relaxation sectionsEGAWA YOSHIMI·Filed 2006·Granted Mar 27, 2012·2 cites·19 claims
- 1859US6426554B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jul 30, 2002·9 cites·16 claims
- 1958US6130480AStructure for packaging semiconductor chipOKI ELECTRIC IND CO LTD·Filed 1998·Granted Oct 10, 2000·22 cites·12 claims
- 2053US7002251B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 21, 2006·5 cites·17 claims
- 2153US5994168AMethod of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Nov 30, 1999·15 cites·9 claims
- 2251US6995038B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 7, 2006·5 cites·10 claims
- 2348US2010025710A1Semiconductor device and fabrication method thereofOKI SEMICONDUCTOR CO LTD·Filed 2009·Application pending·0 cites
- 2446US8500984B2Method for manufacturing printed-circuit boardEGAWA YOSHIMI·Filed 2009·Granted Aug 6, 2013·0 cites·11 claims
- 2546US8435839B2Method of manufacturing semiconductor device and the semiconductor deviceEGAWA YOSHIMI·Filed 2009·Granted May 7, 2013·0 cites·10 claims
- 2646US7179685B2Fabrication method for stacked multi-chip packageOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 20, 2007·1 cites·15 claims
- 2746US6867069B2Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resinOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 15, 2005·3 cites·10 claims
- 2844US6635963B2Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resinOKI ELECTRIC IND CO LTD·Filed 2002·Granted Oct 21, 2003·2 cites·12 claims
- 2942US6204563B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Mar 20, 2001·10 cites·27 claims
- 3037US7317244B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 8, 2008·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →