Inventor · disambiguated record
Yoshiaki Esaki
Also filed as: ESAKI YOSHIAKI
4 granted patents·1 pending application·15 citations·filing 2011–2017
68Inventor score
Top patents by PatentIndex Score
5 records- 0186US9125307B2Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring boardPANASONIC CORP·Filed 2012·Granted Sep 1, 2015·7 cites·17 claims
- 0277US9232636B2Flexible printed wiring board and laminate for production of flexible printed wiring boardOZEKI TAKAYOSHI·Filed 2011·Granted Jan 5, 2016·7 cites·18 claims
- 0372US10751976B2Resin-clad metal foil and flexible printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 0442US10543661B2Metal foil with resin, and metal-clad laminate and circuit board using samePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 28, 2020·0 cites·10 claims
- 0531US2018141311A1Double-sided metal-clad laminate board and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshiaki Esaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →