Inventor · disambiguated record
Yo-Se Eum
Also filed as: EUM YO-SE
4 granted patents·2 pending applications·6 citations·filing 2007–2019
61Inventor score
Top patents by PatentIndex Score
6 records- 0161US10016833B2Solder ball mounterSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 10, 2018·1 cites·8 claims
- 0259US8132305B2Equipment and method for cutting packageCHOI TAI-KEW·Filed 2007·Granted Mar 13, 2012·5 cites·28 claims
- 0349US9113585B2Method of forming external terminals of a package and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·19 claims
- 0447US11018038B2Apparatus for sawing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·0 cites·17 claims
- 0535US2012194214A1Equipment and method to classify semiconductor packagesEUM YO-SE·Filed 2012·Application pending·0 cites
- 0634US2012225150A1Molding apparatus for semiconductor packageHAN DONG-CHUL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →