Inventor · disambiguated record
Yoshitsugu Funada
Also filed as: FUNADA YOSHITSUGU
8 granted patents·1 pending application·346 citations·filing 1993–2001
90Inventor score
Files withNEC CORP9
Top patents by PatentIndex Score
9 records- 0191US5830563AInterconnection structures and method of making sameNEC CORP·Filed 1996·Granted Nov 3, 1998·85 cites·9 claims
- 0290US6078229ASurface acoustic wave device mounted with a resin film and method of making sameNEC CORP·Filed 1998·Granted Jun 20, 2000·135 cites·18 claims
- 0381US6311888B1Resin film and a method for connecting electronic parts by the use thereofNEC CORP·Filed 2000·Granted Nov 6, 2001·31 cites·6 claims
- 0473US6214446B1Resin film and a method for connecting electronic parts by the use thereofNEC CORP·Filed 1999·Granted Apr 10, 2001·39 cites·13 claims
- 0565US5972739AMethod of manufacturing a tab semiconductor deviceNEC CORP·Filed 1998·Granted Oct 26, 1999·33 cites·20 claims
- 0650US5372872AMultilayer printed circuit boardNEC CORP·Filed 1993·Granted Dec 13, 1994·13 cites·8 claims
- 0744US2001011111A1Molded resin composition exhibiting good adhesion to conductive material on a surfaceNEC CORP·Filed 2001·Application pending·0 cites
- 0838US6232398B1Alkali or acid corrodible organic or composite particles in resin matrixNEC CORP·Filed 1997·Granted May 15, 2001·5 cites·9 claims
- 0935US5681648APrinted wiring board and method for preparing the sameNEC CORP·Filed 1996·Granted Oct 28, 1997·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →