Inventor · disambiguated record
Yousuke Futamata
Also filed as: FUTAMATA Yousuke
10 granted patents·3 pending applications·8 citations·filing 2012–2024
80Inventor score
Top patents by PatentIndex Score
13 records- 0190US12469986B2Antenna device and antenna moduleTDK CORP·Filed 2024·Granted Nov 11, 2025·2 cites·10 claims
- 0287US10811176B2Dust coreTDK CORP·Filed 2018·Granted Oct 20, 2020·3 cites·7 claims
- 0374US10071932B2Glass ceramic sintered compact and wiring boardSNAPTRACK INC·Filed 2016·Granted Sep 11, 2018·1 cites·5 claims
- 0468US9538645B2Multilayer wiring substrateEPCOS AG·Filed 2014·Granted Jan 3, 2017·2 cites·16 claims
- 0562US11267749B2Glass ceramic sintered body and wiring substrateTDK CORP·Filed 2020·Granted Mar 8, 2022·0 cites·4 claims
- 0659US11043320B2Dust coreTDK CORP·Filed 2018·Granted Jun 22, 2021·0 cites·19 claims
- 0754US11780767B2Glass ceramic sintered body and wiring substrateTDK CORP·Filed 2020·Granted Oct 10, 2023·0 cites·15 claims
- 0853US2024332822A1Antenna device and antenna moduleTDK CORP·Filed 2024·Application pending·0 cites
- 0951US11545287B2Dust coreTDK CORP·Filed 2017·Granted Jan 3, 2023·0 cites·17 claims
- 1050US10727557B2Dielectric resonator and dielectric filterTDK CORP·Filed 2018·Granted Jul 28, 2020·0 cites·14 claims
- 1150US2024235033A9Antenna moduleTDK CORP·Filed 2023·Application pending·0 cites
- 1249US9648743B2Multilayer glass ceramic substrate with embedded resistorEPCOS AG·Filed 2012·Granted May 9, 2017·0 cites·4 claims
- 1330US2019089044A1Multilayer interconnection substrate for high frequency and manufacturing method thereofSNAPTRACK INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →