Inventor · disambiguated record
Yong-Dae Ha
Also filed as: HA YONG-DAE
6 granted patents·2 pending applications·28 citations·filing 1998–2019
79Inventor score
Top patents by PatentIndex Score
8 records- 0186US10692833B2Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 23, 2020·8 cites·13 claims
- 0281US10330722B2Pipe structure and semiconductor module testing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·2 cites·20 claims
- 0377US9324661B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 26, 2016·3 cites·18 claims
- 0469US8042593B2Semiconductor chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 25, 2011·9 cites·18 claims
- 0565US11482505B2Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 25, 2022·1 cites·12 claims
- 0637US2009035105A1Apparatus for separating chip, a method for fabricating the apparatus, and a method for separating a chipSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0730US6187121B1Die-bonding equipment and a method for detecting residual adhesive material using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·5 cites·23 claims
- 0829US2008000587A1Bonding apparatus of semiconductor packageHA YONG-DAE·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →