Inventor · disambiguated record
Yongdae Ha
Also filed as: HA YONGDAE
4 granted patents·1 pending application·9 citations·filing 2014–2019
63Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0184US9698117B2Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·8 cites·20 claims
- 0258US9455165B2Die bonding deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 27, 2016·1 cites·20 claims
- 0343US10211084B2Chuck table and substrate processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·0 cites·20 claims
- 0440US11456273B2Bonding head and a bonding apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 27, 2022·0 cites·11 claims
- 0540US2014238618A1Die ejector and die separation methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →