Inventor · disambiguated record
Yoichiro Hamada
Also filed as: HAMADA YOICHIRO
4 granted patents·1 pending application·21 citations·filing 1986–2013
70Inventor score
Top patents by PatentIndex Score
5 records- 0152US8188588B2Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2010·Granted May 29, 2012·1 cites·4 claims
- 0247US4742062ABenzylpiperazine compound and pharmaceutical composition as hypolipidemic agentKANEBO LTD·Filed 1986·Granted May 3, 1988·4 cites·3 claims
- 0344US6130027AProcess for producing lead framesSUMITOMO METAL MINING CO·Filed 1998·Granted Oct 10, 2000·16 cites·5 claims
- 0443US9054116B2Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2013·Granted Jun 9, 2015·0 cites·8 claims
- 0537US2012064666A1Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor packageHAMADA YOICHIRO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →