Inventor · disambiguated record

Young Michael Han

Also filed as: HAN YOUNG MICHAEL

0 granted patents·8 pending applications·0 citations·filing 2024–2025

Technology areasH10W

Files withSILICON BOX PTE LTD8

Top patents by PatentIndex Score

8 records

0164US2025219012A1Chip bonding apparatus for semiconductor packaging and semiconductor packaging method using the sameSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
0264US2025219003A1Redistribution layer structure, method of forming redistribution layer structure, semiconductor package device including redistribution layer structure, and method of manufacturing semiconductor package device including redistribution layer structureSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
0363US2025105160A1Interconnection module substrate for semiconductor package, semiconductor package device including the same, and manufacturing methods thereofSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
0458US2025385221A1Semiconductor package device having fan-out structure and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
0553US2025309038A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
0652US2025294682A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
0752US2025293171A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
0852US2025309173A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →