Inventor · disambiguated record
Yoichi Harayama
Also filed as: HARAYAMA YOICHI
18 granted patents·368 citations·filing 1989–2022
94Inventor score
Top patents by PatentIndex Score
18 records- 0191US5737191AStructure and process for mounting semiconductor chipSHINKO ELECTRIC IND CO·Filed 1996·Granted Apr 7, 1998·137 cites·29 claims
- 0282US11699612B2Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing methodSHINKO ELECTRIC IND CO·Filed 2021·Granted Jul 11, 2023·1 cites·11 claims
- 0382US5602059ASemiconductor device and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1995·Granted Feb 11, 1997·72 cites·8 claims
- 0479US10535545B2Substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Jan 14, 2020·3 cites·7 claims
- 0569US5464950AAluminum nitride circuit board and method of producing sameSHINKO ELECTRIC IND CO·Filed 1993·Granted Nov 7, 1995·30 cites·2 claims
- 0667US5604018ACeramic oxide circuit boardSHINKO ELECTRIC IND CO·Filed 1994·Granted Feb 18, 1997·32 cites·14 claims
- 0766US5997999ASintered body for manufacturing ceramic substrateSHINKO ELECTRIC IND CO·Filed 1997·Granted Dec 7, 1999·32 cites·10 claims
- 0866US5229213AAluminum nitride circuit boardSHINKO ELECTRIC IND CO·Filed 1989·Granted Jul 20, 1993·30 cites·1 claims
- 0964US8129259B2Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor deviceHARAYAMA YOICHI·Filed 2010·Granted Mar 6, 2012·3 cites·5 claims
- 1057US7811857B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 12, 2010·1 cites·9 claims
- 1154US12230527B2Electrostatic chuck and substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Feb 18, 2025·0 cites·14 claims
- 1254US11830752B2Substrate fixing device, electrostatic chuck, and method of manufacturing electrostatic chuckSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 28, 2023·0 cites·9 claims
- 1347US11631598B2Substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted Apr 18, 2023·0 cites·12 claims
- 1447US10361110B2Substrate holding apparatusSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 23, 2019·0 cites·5 claims
- 1544US5683791ACeramic oxide circuit boardSHINKO ELECTRIC IND CO·Filed 1996·Granted Nov 4, 1997·10 cites·2 claims
- 1641US5733640AFired body for manufacturing a substrateSHINKO ELECTRIC IND CO·Filed 1995·Granted Mar 31, 1998·9 cites·10 claims
- 1740US9538668B2Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layerSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 3, 2017·0 cites·4 claims
- 1839US5702807ACeramic circuit board and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 1996·Granted Dec 30, 1997·8 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →