Inventor · disambiguated record
Yotaro Hattori
Also filed as: HATTORI YOTARO
6 granted patents·6 pending applications·42 citations·filing 2006–2011
81Inventor score
Top patents by PatentIndex Score
12 records- 0186US8044235B2(Meth) acryloyl group-containing aromatic isocyanate compound and production process thereofSHOWA DENKO KK·Filed 2006·Granted Oct 25, 2011·11 cites·7 claims
- 0284US8349934B2Hardening composition and hardened product thereofSHOWA DENKO KK·Filed 2009·Granted Jan 8, 2013·7 cites·15 claims
- 0383US8399569B2Reactive urethane compound having ether bond, curable composition, and cured materialMUROFUSHI KATSUMI·Filed 2008·Granted Mar 19, 2013·11 cites·4 claims
- 0483US7888399B2Curable composition containing thiol compoundSHOWA DENKO KK·Filed 2007·Granted Feb 15, 2011·9 cites·17 claims
- 0573US8283095B2Thiourethane compound and photosensitive resin compositionIKEDA HARUHIKO·Filed 2007·Granted Oct 9, 2012·3 cites·13 claims
- 0663US8053167B2Curable compositions containing hydroxythiol compound, and cured products thereofSHOWA DENKO KK·Filed 2007·Granted Nov 8, 2011·1 cites·21 claims
- 0750US2010087611A1Urethane compound, curable composition containing the same, and cured product thereofSHOWA DENKO KK·Filed 2008·Application pending·0 cites
- 0850US2010210812A1Curable composition and cured product thereofSHOWA DENKO KK·Filed 2008·Application pending·0 cites
- 0949US2011077334A1Curable composition containing reactive (meth) acrylate polymer and cured products thereofSHOWA DENKO KK·Filed 2009·Application pending·0 cites
- 1045US2010174109A1Method for producing ethylenically unsaturated group-containing isocyanate compound having ether bondSHOWA DENKO KK·Filed 2008·Application pending·0 cites
- 1141US2010029876A1Polymerization accelerator, curable composition, cured product, and process for producing thiol compoundMIYATA HIDEO·Filed 2007·Application pending·0 cites
- 1234US2013237629A1Curable resin compositionDOI MITSURU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →