Inventor · disambiguated record
Yoshikazu Hirano
Also filed as: HIRANO YOSHIKAZU
7 granted patents·2 pending applications·42 citations·filing 1997–2019
77Inventor score
Top patents by PatentIndex Score
9 records- 0171US8338715B2PCB with soldering pad projections forming fillet solder joints and method of production thereofHIRANO YOSHIKAZU·Filed 2008·Granted Dec 25, 2012·7 cites·7 claims
- 0266US6482676B2Method of mounting semiconductor chip part on substrateFUJITSU LTD·Filed 1997·Granted Nov 19, 2002·35 cites·19 claims
- 0352US10299387B2Substrate on which electronic component is soldered, electronic device, method for soldering electronic componentFUJITSU LTD·Filed 2018·Granted May 21, 2019·0 cites·5 claims
- 0451US11436391B2Learning method and automatic layout design methodKYOCERA CORP·Filed 2019·Granted Sep 6, 2022·0 cites·22 claims
- 0543US8701488B2Electronic component analyzing apparatus and methodHIRANO YOSHIKAZU·Filed 2011·Granted Apr 22, 2014·0 cites·18 claims
- 0637US2011154888A1Analysis deviceARKRAY INC·Filed 2009·Application pending·0 cites
- 0735US8429984B2Flow sensor and analysis device provided with sameFURUSATO NORIAKI·Filed 2009·Granted Apr 30, 2013·0 cites·4 claims
- 0834US8424391B2Analysis device provided with flow sensor, and flow sensor adjustment methodFURUSATO NORIAKI·Filed 2009·Granted Apr 23, 2013·0 cites·3 claims
- 0931US2017092451A1Switch and electronic deviceKYOCERA CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →