Inventor · disambiguated record
Yoshiyuki Hiroshima
Also filed as: HIROSHIMA YOSHIYUKI
21 granted patents·2 pending applications·23 citations·filing 2006–2021
91Inventor score
Top patents by PatentIndex Score
23 records- 0184US9188743B2Optical coupling structure and optical transmission apparatusFUJITSU LTD·Filed 2013·Granted Nov 17, 2015·7 cites·8 claims
- 0283US9992878B2Circuit board and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jun 5, 2018·4 cites·9 claims
- 0378US10877216B2Optical waveguide substrate, method of manufacturing optical waveguide substrate, and method of repairing optical waveguide substrateFUJITSU LTD·Filed 2019·Granted Dec 29, 2020·2 cites·7 claims
- 0474US10353158B2Light emitting element bonded board and method of manufacturing light emitting element bonded boardFUJITSU LTD·Filed 2017·Granted Jul 16, 2019·2 cites·5 claims
- 0574US9148958B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Sep 29, 2015·2 cites·2 claims
- 0668US10212805B2Printed circuit board and electric deviceFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·1 cites·9 claims
- 0767US9715062B2Optical axis adjustment method for optical interconnection, and optical interconnection substrateFUJITSU LTD·Filed 2015·Granted Jul 25, 2017·1 cites·10 claims
- 0867US8958211B2Circuit board and electronic deviceHIROSHIMA YOSHIYUKI·Filed 2011·Granted Feb 17, 2015·2 cites·9 claims
- 0966US11158964B2Electronic component and substrateFUJITSU LTD·Filed 2020·Granted Oct 26, 2021·0 cites·7 claims
- 1065US9763331B2Printed circuit board, electronic device, and manufacturing methodFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·1 cites·9 claims
- 1162US10714849B2Electronic component and substrateFUJITSU LTD·Filed 2019·Granted Jul 14, 2020·1 cites·10 claims
- 1256US10151878B2Optical interconnection substrate including optical transmitter with light source and mark or optical receiver with light receiving unit and markFUJITSU LTD·Filed 2017·Granted Dec 11, 2018·0 cites·9 claims
- 1356US9572293B2Placement apparatus and a suction nozzle for an optical componentFUJITSU LTD·Filed 2014·Granted Feb 14, 2017·0 cites·14 claims
- 1454US11749874B2Balanced-type circular disk resonator, dielectric property measurement method, and dielectric property measurement systemFUJITSU LTD·Filed 2021·Granted Sep 5, 2023·0 cites·10 claims
- 1552US9470856B2Method of manufacturing photoelectric composite substrateFUJITSU LTD·Filed 2013·Granted Oct 18, 2016·0 cites·5 claims
- 1651US10929585B2Recording medium recording via lifetime calculation program, via lifetime calculation method, and information processing deviceFUJITSU LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1751US10492291B2Wiring board manufacturing methodFUJITSU LTD·Filed 2017·Granted Nov 26, 2019·0 cites·10 claims
- 1850US8777091B2Light emitting member mounting method and apparatusFUJITSU LTD·Filed 2013·Granted Jul 15, 2014·0 cites·3 claims
- 1949US10164312B2Wiring board, electronic apparatus, and manufacturing method of wiring boardFUJITSU LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 2047US10783309B2Method for outputting impact degree and information processing deviceFUJITSU LTD·Filed 2019·Granted Sep 22, 2020·0 cites·15 claims
- 2147US8030578B2Electronic component and substrate unitFUJITSU LTD·Filed 2006·Granted Oct 4, 2011·0 cites·6 claims
- 2245US2012234587A1Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring boardNAKAMURA NAOKI·Filed 2012·Application pending·0 cites
- 2336US2012106105A1Wiring board having a plurality of viasSUGANE MITSUHIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →