Inventor · disambiguated record
Yoichi Hitomi
Also filed as: HITOMI YOICHI
9 granted patents·2 pending applications·312 citations·filing 1998–2016
84Inventor score
Top patents by PatentIndex Score
11 records- 0196US6201292B1Resin-sealed semiconductor device, circuit member used thereforDAINIPPON PRINTING CO LTD·Filed 1998·Granted Mar 13, 2001·300 cites·62 claims
- 0271US9586343B2Method for producing nanoimprint moldDAINIPPON PRINTING CO LTD·Filed 2013·Granted Mar 7, 2017·1 cites·20 claims
- 0371US8198726B2Through-hole electrode substrate and method of manufacturing the sameNAKAYAMA KOICHI·Filed 2009·Granted Jun 12, 2012·4 cites·10 claims
- 0471US8097811B2Substrate for suspensionHITOMI YOICHI·Filed 2008·Granted Jan 17, 2012·7 cites·4 claims
- 0559US2017103777A1Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveDAINIPPON PRINTING CO LTD·Filed 2016·Application pending·0 cites
- 0657US8927122B2Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveHITOMI YOICHI·Filed 2008·Granted Jan 6, 2015·0 cites·17 claims
- 0753US9564153B2Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveDAINIPPON PRINTING CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·4 claims
- 0849US8623751B2Through-hole electrode substrate and method of manufacturing the sameNAKAYAMA KOICHI·Filed 2012·Granted Jan 7, 2014·0 cites·10 claims
- 0949US8040634B2Magnetic head suspensionDAINIPPON PRINTING CO LTD·Filed 2006·Granted Oct 18, 2011·0 cites·16 claims
- 1044US8399774B2Substrate for suspensionHITOMI YOICHI·Filed 2011·Granted Mar 19, 2013·0 cites·8 claims
- 1133US2004101666A1Inspection contact sheet and method of fabricating the sameDAI NIPPON PRTG CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →