Inventor · disambiguated record
Yong Min Hong
Also filed as: HONG YONG MIN · HONG YONG S
7 granted patents·8 pending applications·0 citations·filing 2006–2024
70Inventor score
Top patents by PatentIndex Score
15 records- 0163US12275220B2Method for compressing laminate and method for manufacturing ceramic electronic component including laminateSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 0263US10340087B2Multilayer electronic component having first internal electrode base patterns exposed to an end and opposing side surfaces of a body, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 2, 2019·0 cites·26 claims
- 0362US10249437B2Multilayer electronic component with side parts on external surfaces, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 2, 2019·0 cites·9 claims
- 0459US10181380B2Multilayer electronic component having first and second internal elctrode patterns alternately stacked, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 15, 2019·0 cites·33 claims
- 0559US10090107B2Multilayer electronic component having first internal electrode base patterns exposed to an end and opposing side surfaces of a body, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 2, 2018·0 cites·26 claims
- 0658US2025201480A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0757US12387879B2Multilayer electronic component and method of manufacturing multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Aug 12, 2025·0 cites·17 claims
- 0857US2024387114A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0957US2024355548A1Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1056US10049820B2Multilayer electronic component having first and second internal electrode base patterns exposed to different respective end and side surfaces of a body, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 14, 2018·0 cites·13 claims
- 1154US2024112864A1Method of manufacturing multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1253US2024203651A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1338US2017032883A1Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1437US2016293319A1Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1532US2007163706A1Method of bonding different kinds of gemstonesHONG YONG S·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →