Inventor · disambiguated record
Yongjun Huo
Also filed as: HUO YONGJUN
2 granted patents·0 citations·filing 2019–2021
27Inventor score
Technology areasH10W
Files withLIGHT MED USA INC2
Top patents by PatentIndex Score
2 records- 0152US11894284B2Semiconductor structure having silver-indium transient liquid phase bonding jointLIGHT MED USA INC·Filed 2021·Granted Feb 6, 2024·0 cites·7 claims
- 0237US11373925B2Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding jointLIGHT MED USA INC·Filed 2019·Granted Jun 28, 2022·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →