Inventor · disambiguated record
Youngho Hwang
Also filed as: HWANG YOUNGHO
1 granted patent·12 pending applications·1 citations·filing 2017–2025
15Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0170US11456195B2Wafer processing apparatus and wafer processing method using the same apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 0261US2025021025A1Substrate processing method and substrate processing apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0358US2025155814A1Spin coating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0457US2024192604A1Post baking apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0553US2025189355A1Metal storage device, metal injection system including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2025031281A1Substrate supporting member and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0752US2025328078A1Developer supply equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0851US2023411155A1Manufacturing method of semiconductor element by using extreme ultra violetSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024234193A9Wafer processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1042US2025370345A1Heat treatment apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1135US2020260534A1Heating module and semiconductor fabricating system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1228US2018164171A1Method of correcting estimated force of bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1322US2018040496A1Electrostatic chuck system and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →