Inventor · disambiguated record
Yohsuke Ishikawa
Also filed as: ISHIKAWA YOHSUKE
4 granted patents·3 pending applications·9 citations·filing 2011–2020
64Inventor score
Top patents by PatentIndex Score
7 records- 0178US11638349B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·19 claims
- 0277US9232636B2Flexible printed wiring board and laminate for production of flexible printed wiring boardOZEKI TAKAYOSHI·Filed 2011·Granted Jan 5, 2016·7 cites·18 claims
- 0372US10751976B2Resin-clad metal foil and flexible printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 0450US11452216B2Method for manufacturing multilayer printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 20, 2022·0 cites·10 claims
- 0548US2020157300A1Resin composition, prepreg, metal-clad laminate, printed wiring board, and method for fabricating the metal-clad laminatePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 0639US2022259378A1Resin composition, prepreg, method for manufacturing prepreg, laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 0731US2018141311A1Double-sided metal-clad laminate board and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →