Inventor · disambiguated record
Yoshikatsu Ishizuki
Also filed as: ISHIZUKI YOSHIKATSU
25 granted patents·4 pending applications·275 citations·filing 1993–2017
96Inventor score
Top patents by PatentIndex Score
29 records- 0192US7355290B2Interposer and method for fabricating the sameFUJITSU LTD·Filed 2006·Granted Apr 8, 2008·20 cites·9 claims
- 0291US6001488AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Dec 14, 1999·58 cites·4 claims
- 0386US9837208B2Inductor apparatus and inductor apparatus manufacturing methodFUJITSU LTD·Filed 2014·Granted Dec 5, 2017·5 cites·11 claims
- 0486US7405366B2Interposer and electronic device fabrication methodFUJITSU LTD·Filed 2006·Granted Jul 29, 2008·12 cites·11 claims
- 0585US7514295B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·12 cites·10 claims
- 0683US8704106B2Ferroelectric component and manufacturing the sameMIZUKOSHI MASATAKA·Filed 2011·Granted Apr 22, 2014·8 cites·9 claims
- 0783US7614142B2Method for fabricating an interposerFUJITSU LTD·Filed 2008·Granted Nov 10, 2009·11 cites·12 claims
- 0878US5386430AExcimer laser processing method and apparatusFUJITSU LTD·Filed 1993·Granted Jan 31, 1995·46 cites·24 claims
- 0977US7937830B2Interposer and electronic device fabrication methodFUJITSU LTD·Filed 2008·Granted May 10, 2011·5 cites·2 claims
- 1071US7816180B2Method for processing a base that includes connecting a first base to a second baseFUJITSU LTD·Filed 2009·Granted Oct 19, 2010·4 cites·17 claims
- 1171US5783639AComposition of epoxy group-containing cycloolefin resinNIPON ZEON CO LTD·Filed 1997·Granted Jul 21, 1998·27 cites·7 claims
- 1268US9312151B2Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support memberFUJITSU LTD·Filed 2013·Granted Apr 12, 2016·2 cites·14 claims
- 1368US9136172B2Method of manufacturing semiconductor device and method of manufacturing electronic assemblyFUJITSU LTD·Filed 2013·Granted Sep 15, 2015·2 cites·14 claims
- 1465US7852439B2Multi-layer display element and manufacturing method for the sameFUJITSU LTD·Filed 2009·Granted Dec 14, 2010·2 cites·20 claims
- 1564US7811835B2Method for processing a base that includes connecting a first base to a second base with an insulating filmFUJITSU LTD·Filed 2009·Granted Oct 12, 2010·2 cites·7 claims
- 1662US2018068787A1Inductor apparatus and inductor apparatus manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1761US9214361B2Semiconductor device manufacturing method and electronic device manufacturing methodFUJITSU LTD·Filed 2013·Granted Dec 15, 2015·1 cites·5 claims
- 1861US5895800AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Apr 20, 1999·21 cites·8 claims
- 1958US8962470B2Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusMIZUKOSHI MASATAKA·Filed 2009·Granted Feb 24, 2015·1 cites·5 claims
- 2056US6943447B2Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layerFUJITSU LTD·Filed 2003·Granted Sep 13, 2005·6 cites·7 claims
- 2152US5886136APattern forming processNIPPON ZEON CO·Filed 1997·Granted Mar 23, 1999·12 cites·28 claims
- 2251US9888575B2Electronic device and method for manufacturing electronic deviceFUJITSU LTD·Filed 2017·Granted Feb 6, 2018·0 cites·6 claims
- 2348US5777068APhotosensitive polyimide resin compositionNIPPON ZEON CO·Filed 1995·Granted Jul 7, 1998·11 cites·25 claims
- 2447US2005161814A1Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2541US10483195B2Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit boardFUJITSU LTD·Filed 2017·Granted Nov 19, 2019·0 cites·11 claims
- 2641US2005109533A1Circuit board and manufacturing method thereof that can easily provide insulating film between projecting electrodesFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2740US10057995B2Electronic deviceFUJITSU LTD·Filed 2015·Granted Aug 21, 2018·0 cites·8 claims
- 2840US2006027936A1Method for processing baseFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2936US5429709AMethod of manufacturing polyimide multilayer printed wiring boardsFUJITSU LTD·Filed 1994·Granted Jul 4, 1995·7 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →