Inventor · disambiguated record
Yorio Iwasaki
Also filed as: IWASAKI YORIO
12 granted patents·403 citations·filing 1978–2000
93Inventor score
Top patents by PatentIndex Score
12 records- 0189US5929741ACurrent protectorHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jul 27, 1999·71 cites·3 claims
- 0286US5309632AProcess for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted May 10, 1994·66 cites·9 claims
- 0386US4216246AMethod of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1978·Granted Aug 5, 1980·48 cites·6 claims
- 0485US6064111ASubstrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI COMPANY LTD·Filed 1997·Granted May 16, 2000·84 cites·11 claims
- 0578US6236108B1Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 22, 2001·24 cites·14 claims
- 0660US5403869AAdhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiatorHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·17 cites·3 claims
- 0759US5584121AProcess for producing multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Dec 17, 1996·12 cites·5 claims
- 0858US5486655AMultiple wire adhesive on a multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jan 23, 1996·16 cites·2 claims
- 0957US4791238AHigh-density wired circuit board using insulated wiresHITACHI CHEMICAL CO LTD·Filed 1987·Granted Dec 13, 1988·18 cites·20 claims
- 1055US5233133ACoaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1991·Granted Aug 3, 1993·17 cites·2 claims
- 1154US5323534AProcess for producing coaxial conductor interconnection wiring boardHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jun 28, 1994·17 cites·6 claims
- 1248US5053280AAdhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agentHITACHI CHEMICAL CO LTD·Filed 1989·Granted Oct 1, 1991·13 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →