Inventor · disambiguated record
Yoshihide Iwazaki
Also filed as: IWAZAKI YOSHIHIDE
11 granted patents·8 pending applications·235 citations·filing 1995–2010
91Inventor score
Top patents by PatentIndex Score
19 records- 0192US6838748B2Semiconductor element with electromagnetic shielding layer on back/side face(s) thereofSHARP KK·Filed 2003·Granted Jan 4, 2005·70 cites·18 claims
- 0286US7091616B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2002·Granted Aug 15, 2006·42 cites·16 claims
- 0377US6046072AProcess for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 4, 2000·44 cites·14 claims
- 0476US7445958B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2006·Granted Nov 4, 2008·6 cites·17 claims
- 0574US6558791B2Heat-resistant adhesive sheetHITACHI CHEMICAL CO LTD·Filed 2001·Granted May 6, 2003·16 cites·33 claims
- 0662US6248613B1Process for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jun 19, 2001·22 cites·13 claims
- 0761US6940175B2Semiconductor device in which a plurality of electronic components are combined with each otherSHARP KK·Filed 2002·Granted Sep 6, 2005·9 cites·10 claims
- 0855US2010147376A1Solar battery device, method of producing same, and electronic deviceIWAZAKI YOSHIHIDE·Filed 2009·Application pending·0 cites
- 0954US2010101626A1Solar battery apparatus, portable electronic device, and global positioning system apparatusIWAZAKI YOSHIHIDE·Filed 2009·Application pending·0 cites
- 1050US6372080B1Process for fabricating a crack resistant resin encapsulated semiconductor chip packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Apr 16, 2002·17 cites·12 claims
- 1143US2005194686A1Semiconductor device and manufacturing method for the sameSHARP KK·Filed 2005·Application pending·0 cites
- 1241US2006226018A1Plating apparatus, plating method, and method for manufacturing semiconductor deviceSHARP KK·Filed 2006·Application pending·0 cites
- 1341US2005104165A1Semiconductor element, semiconductor device, and method for manufacturing semiconductor elementSHARP KK·Filed 2004·Application pending·0 cites
- 1440US2008105555A1Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor DeviceIWAZAKI YOSHIHIDE·Filed 2005·Application pending·0 cites
- 1539US2010294342A1Solar cell module and electronics device including the solar cell moduleNAKANISHI HIROYUKI·Filed 2010·Application pending·0 cites
- 1636US6831002B2Manufacturing method of semiconductor deviceSHARP KK·Filed 2002·Granted Dec 14, 2004·0 cites·23 claims
- 1736US5955779AMethod of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image removerHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 21, 1999·5 cites·3 claims
- 1834US5958653AMethod of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 28, 1999·4 cites·11 claims
- 1929US2001013643A1Semiconductor integrated circuit deviceFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →