Inventor · disambiguated record
Youngkun Jee
Also filed as: JEE YOUNGKUN
2 granted patents·34 pending applications·4 citations·filing 2022–2025
48Inventor score
Technology areasH10W
Top patents by PatentIndex Score
36 records- 0193US12218102B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·3 cites·20 claims
- 0285US12489071B2Semiconductor chip and semiconductor package including bonding layers having alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·1 cites·20 claims
- 0363US2025167178A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0460US2025349807A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0560US2025357452A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0660US2025183195A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025105216A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025096066A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025210594A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1059US2025087647A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025157875A1Semiconductor package with heat dissipation through thermal viasSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1258US2024429174A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US2024429198A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1458US2025125302A1Semiconductor package with non-conductive support layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2024421016A1Semiconductor package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025014974A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025174541A1Semiconductor package including conductive post and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2025125293A1Semiconductor package having improved thermal characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1958US2025015042A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025174555A1Semiconductor chip, semiconductor package, and semiconductor chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2157US2024429222A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2257US2024429200A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2357US2025079403A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US2025015063A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2557US2025079365A1Semiconductor package for increasing bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2657US2025006618A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2756US2024429203A1Semiconductor package and fabricating method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2856US2024429197A1Semiconductor package and method of manufacturing the sameSAMSUNG RO ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2956US2025087624A1Semiconductor chip bonding apparatus and semiconductor package manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3056US2025226354A1Apparatus for stacking chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3155US2024395764A1Bonding apparatus for semiconductor device and method of bonding semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3255US2025006582A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3354US2024088006A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3449US2025336742A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3544US2025349782A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3644US2025349781A1Semiconductor package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →