Inventor · disambiguated record
Young Kun Jee
Also filed as: JEE YOUNG KUN
21 granted patents·15 pending applications·186 citations·filing 2007–2024
94Inventor score
Top patents by PatentIndex Score
36 records- 0197US8802495B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 12, 2014·87 cites·21 claims
- 0296US9543276B2Chip-stacked semiconductor packageJEE YOUNG-KUN·Filed 2015·Granted Jan 10, 2017·55 cites·13 claims
- 0393US11222873B2Semiconductor packages including stacked substrates and penetration electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0492US9721930B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·11 cites·18 claims
- 0591US11935873B2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 19, 2024·1 cites·17 claims
- 0686US11282792B2Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0785US10685921B2Semiconductor chip module including a channel for controlling warpage and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·4 cites·20 claims
- 0882US9721926B2Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 1, 2017·4 cites·27 claims
- 0981US10818603B2Semiconductor package having redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 27, 2020·3 cites·20 claims
- 1076US9376541B2Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 1175US8742577B2Semiconductor package having an anti-contact layerJEE YOUNG-KUN·Filed 2012·Granted Jun 3, 2014·4 cites·19 claims
- 1273US9324683B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·3 cites·12 claims
- 1371US11621250B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 4, 2023·0 cites·20 claims
- 1469US10020290B2Semiconductor device having stacked semiconductor chips interconnected via TSVCHOE YEONG HWAN·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
- 1568US9159651B2Semiconductor packages having TSV and adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·2 cites·16 claims
- 1667US9589947B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·16 claims
- 1765US12300665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·21 claims
- 1862US11488910B2Semiconductor package having redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·18 claims
- 1959US2025079362A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2024332256A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2158US2024170459A1Semiconductor package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2257US2024194639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2356US2024105679A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2456US2024014177A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US11227855B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·14 claims
- 2652US2022173044A1Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2750US8987904B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·13 claims
- 2847US2012280405A1Semiconductor packages and methods of manufacuring the sameHWANG JIHWAN·Filed 2012·Application pending·0 cites
- 2946US2008237314A1Method of joining electronic package capable of prevention for brittle fractureYU JIN·Filed 2007·Application pending·0 cites
- 3045US9082871B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 14, 2015·0 cites·10 claims
- 3144US2008237894A1Integrated circuit package and method for the sameKIM KI-HYUN·Filed 2008·Application pending·0 cites
- 3242US2013330925A1Methods of treating a device-substrate and support-substrates used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3340US2010240174A1Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using ThereofYU JIN·Filed 2007·Application pending·0 cites
- 3438US2012223433A1Semiconductor package including connecting member having controlled content ratio of goldJEE YOUNG-KUN·Filed 2012·Application pending·0 cites
- 3537US2008265006A1Method for bonding electronic components finished with electroless NiXP for preventing brittle fractureYU JIN·Filed 2007·Application pending·0 cites
- 3635US2020075561A1Semiconductor packageKIM JI HWANG·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Young Kun Jee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →