Inventor · disambiguated record
Yoonyoung Jeon
Also filed as: JEON YOONYOUNG
1 granted patent·5 pending applications·0 citations·filing 2022–2024
9Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0152US2024321722A1Semiconductor package, and redistribution substrate for semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0252US2025079421A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0349US12237252B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 0449US2024194577A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0549US2024021530A1Semiconductor package including connection layerJEON YOONYOUNG·Filed 2023·Application pending·0 cites
- 0642US2024321713A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →