Inventor · disambiguated record
Young Doo Jeon
Also filed as: JEON YOUNG DOO
6 granted patents·9 pending applications·68 citations·filing 2000–2025
78Inventor score
Top patents by PatentIndex Score
15 records- 0194US9548288B1Integrated circuit die decoupling system with reduced inductanceAPPLE INC·Filed 2015·Granted Jan 17, 2017·17 cites·17 claims
- 0287US6362090B1Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating methodKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Mar 26, 2002·50 cites·4 claims
- 0368US11908819B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0468US11545455B2Semiconductor packaging substrate fine pitch metal bump and reinforcement structuresAPPLE INC·Filed 2019·Granted Jan 3, 2023·1 cites·22 claims
- 0564US11935952B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0663US2025253255A1Unitized Finger to Bump Interposer PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 0761US2025329673A1Direct Wire Reveal PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 0860US2024421013A1Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated CircuitAPPLE INC·Filed 2024·Application pending·0 cites
- 0960US2024421126A1Chip Singulation Assisted Structures and Methods for Improving Bonding Interface QualityAPPLE INC·Filed 2024·Application pending·0 cites
- 1054US2023245988A1Harvested Reconstitution BumpingAPPLE INC·Filed 2022·Application pending·0 cites
- 1154US2024249989A1Selectively Dispensed Underfill and Edge Bond PatternsAPPLE INC·Filed 2023·Application pending·0 cites
- 1253US2025391664A1Plasma Dicing for Multi-Tier Die for Die Strength Enhancement and Irregular Shaped DicingAPPLE INC·Filed 2025·Application pending·0 cites
- 1351US11469325B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 1442US2009130601A1Method for fabricating semiconductor deviceJEON YOUNG-DOO·Filed 2008·Application pending·0 cites
- 1540US2008035980A1Mask for forming contact holeJEON YOUNG-DOO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →