Inventor · disambiguated record

Young Hun Jun

Also filed as: JUN YOUNG HUN

1 granted patent·1 pending application·0 citations·filing 2021–2023

13Inventor score

Technology areasH10W

Files withMAGNACHIP SEMICONDUCTOR LTD2

Top patents by PatentIndex Score

2 records

0167US2024128123A1Method for forming semiconductor die and semiconductor device thereofMAGNACHIP SEMICONDUCTOR LTD·Filed 2023·Application pending·0 cites
0262US11887892B2Method for forming semiconductor die with die region and seal-ring regionMAGNACHIP SEMICONDUCTOR LTD·Filed 2021·Granted Jan 30, 2024·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →