Inventor · disambiguated record
Yoichi Kamikoriyama
Also filed as: KAMIKORIYAMA YOICHI
9 granted patents·4 pending applications·37 citations·filing 2002–2016
83Inventor score
Files withMITSUI MINING & SMELTING CO9KAMIKORIYAMA YOICHI2MITSUI MINNING & SMELTING CO LTD1POWDERTECH CO LTD1
Top patents by PatentIndex Score
13 records- 0185US8043535B2Conductive inkMITSUI MINING & SMELTING CO·Filed 2005·Granted Oct 25, 2011·17 cites·1 claims
- 0281US10340154B2Bonding junction structureMITSUI MINING & SMELTING CO·Filed 2016·Granted Jul 2, 2019·3 cites·16 claims
- 0365US6746628B2Aqueous nickel slurry, method for preparing the same and conductive pasteMITSUI MINING & SMELTING CO·Filed 2002·Granted Jun 8, 2004·10 cites·19 claims
- 0460US8486306B2Nickel ink and conductor film formed of nickel inkKAMIKORIYAMA YOICHI·Filed 2006·Granted Jul 16, 2013·4 cites·15 claims
- 0557US8012378B2Nickel inkMITSUI MINNING & SMELTING CO LTD·Filed 2007·Granted Sep 6, 2011·2 cites·9 claims
- 0656US10518323B2Copper power and method for producing sameMITSUI MINING & SMELTING CO·Filed 2013·Granted Dec 31, 2019·0 cites·7 claims
- 0754US7476483B2Carrier for electrophotographic developer and two-component electrophotographic developerMITSUI MINING & SMELTING CO·Filed 2005·Granted Jan 13, 2009·1 cites·25 claims
- 0853US10994331B2Copper powder and conductive composition containing sameMITSUI MINING & SMELTING CO·Filed 2016·Granted May 4, 2021·0 cites·6 claims
- 0946US2010155103A1Electrically conductive inkMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1040US2009293766A1Conductive inkMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 1134US7288355B2Carrier for electrophotography developers, developer prepared by using the carrier and method for forming imagePOWDERTECH CO LTD·Filed 2004·Granted Oct 30, 2007·0 cites·26 claims
- 1232US2007256857A1Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive PasteKAMIKORIYAMA YOICHI·Filed 2005·Application pending·0 cites
- 1331US2017140847A1Conductor connection structure, method for producing same, conductive composition, and electronic component moduleMITSUI MINING & SMELTING CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →