Inventor · disambiguated record
Yoshiharu Kaneda
Also filed as: KANEDA YOSHIHARU
20 granted patents·247 citations·filing 1994–2015
94Inventor score
Files withRENESAS ELECTRONICS CORP10MITSUBISHI ELECTRIC CORP3KANSAI ELECTRIC POWER CO2NEC ELECTRONICS CORP2WATANABE YOSHIMASA2
Top patents by PatentIndex Score
20 records- 0189US6507093B2Lead frame for fabricating surface mount type semiconductor devices with high reliabilityNEC CORP·Filed 2001·Granted Jan 14, 2003·77 cites·4 claims
- 0288US6452416B1Abnormality detecting apparatus for a rotating electric machineMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 17, 2002·43 cites·14 claims
- 0385US9147647B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 29, 2015·6 cites·8 claims
- 0482US5680059AAbnormality detecting method and apparatus for electric equipment, particularly for a rotating electric machineKANSAI ELECTRIC POWER CO·Filed 1994·Granted Oct 21, 1997·42 cites·3 claims
- 0576US6114871AAbnormality detecting method and apparatus for electrical equipment, particularly for a rotating electric machineMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 5, 2000·34 cites·7 claims
- 0671US5828227AAbnormality detecting apparatus for electric equipment, particularly for a rotating electric machineKANSAI ELECTRIC POWER CO·Filed 1997·Granted Oct 27, 1998·28 cites·4 claims
- 0770US9076777B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 7, 2015·2 cites·7 claims
- 0865US9030210B2Insulation deterioration diagnosis apparatusWATANABE YOSHIMASA·Filed 2011·Granted May 12, 2015·2 cites·5 claims
- 0962US7985624B2Method of manufacturing semiconductor device having plural dicing stepsRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·2 cites·11 claims
- 1061US8872316B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 28, 2014·1 cites·15 claims
- 1153US7165014B2Partial discharge monitoring apparatus and partial discharge remote monitoring system for rotating electric machinesMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jan 16, 2007·9 cites·13 claims
- 1252US9349675B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·0 cites·4 claims
- 1352US9240368B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 19, 2016·0 cites·8 claims
- 1451US7875468B2Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jan 25, 2011·0 cites·10 claims
- 1548US9385071B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·0 cites·7 claims
- 1647US7858447B2Lead frame, semiconductor device, and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Dec 28, 2010·0 cites·20 claims
- 1744US7582974B2Semiconductor device and method of manufacturing sameNEC ELECTRONICS CORP·Filed 2008·Granted Sep 1, 2009·0 cites·16 claims
- 1843US8048718B2Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portionRENESAS ELECTRONICS CORP·Filed 2007·Granted Nov 1, 2011·0 cites·8 claims
- 1940US6677666B2Lead frame for fabricating surface mount type semiconductor devices with high reliabilityNEC ELECTRONICS CORP·Filed 2002·Granted Jan 13, 2004·1 cites·14 claims
- 2037US9335380B2Device for detecting insulation degradationWATANABE YOSHIMASA·Filed 2010·Granted May 10, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →