Inventor · disambiguated record
Yonghee Kang
Also filed as: KANG YONGHEE
24 granted patents·10 pending applications·53 citations·filing 2008–2025
93Inventor score
Top patents by PatentIndex Score
34 records- 0195US11912911B2Quantum dot, curable composition comprising the same, cured layer using the composition and color filter including the cured layerSAMSUNG SDI CO LTD·Filed 2020·Granted Feb 27, 2024·4 cites·21 claims
- 0292US8492197B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateCHO SUNGWON·Filed 2010·Granted Jul 23, 2013·14 cites·31 claims
- 0390US12412960B2Porous separator and lithium secondary battery comprising sameLG ENERGY SOLUTION LTD·Filed 2024·Granted Sep 9, 2025·0 cites·19 claims
- 0489US12002990B2Porous separator and lithium secondary battery comprising sameLG CHEMICAL LTD·Filed 2019·Granted Jun 4, 2024·2 cites·15 claims
- 0589US11866624B2Non-solvent type curable composition, cured layer using the same, color filter including the cured layer, display device including the cured layer and manufacturing method of the cured layerSAMSUNG SDI CO LTD·Filed 2020·Granted Jan 9, 2024·2 cites·19 claims
- 0686US8169071B2Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingersJANG KIYOUN·Filed 2011·Granted May 1, 2012·7 cites·31 claims
- 0783US8786076B2Semiconductor device and method of forming a thermally reinforced semiconductor dieKIM OHHAN·Filed 2011·Granted Jul 22, 2014·7 cites·19 claims
- 0880US12312521B2Non-solvent type curable composition, cured layer using the same, color filter including the cured layer, display device including the cured layer and manufacturing method of the cured layerSAMSUNG SDI CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0979US11760926B2Quantum dot, curable composition comprising the same, cured layer using the composition, color filter including the cured layer, and display device including the cured layerSAMSUNG SDI CO LTD·Filed 2020·Granted Sep 19, 2023·1 cites·20 claims
- 1076US11762289B2Composition including quantum dot, manufacturing method quantum dot and color filterSAMSUNG SDI CO LTD·Filed 2018·Granted Sep 19, 2023·1 cites·18 claims
- 1175US7851345B2Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bondingSTATS CHIPPAC LTD·Filed 2008·Granted Dec 14, 2010·8 cites·25 claims
- 1275US2024027906A1Composition including quantum dot, manufacturing method quantum dot and color filterSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 1373US8994048B2Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integrationCHOI JOONYOUNG·Filed 2010·Granted Mar 31, 2015·4 cites·29 claims
- 1472US2024327700A1Curable composition, cured layer using the same and display device including the cured layerSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1572US2025171682A1Non-solvent type curable composition, cured layer using the same, color filter including the cured layer, display device including the cured layer and manufacturing method of the cured layerSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 1672US2024327702A1Curable composition, cured layer using the composition and display device including the cured layerSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1770US2024343932A1Curable composition, cured layer using the same and display device including the cured layerSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1867US2025326876A1Curable composition, cured layer manufactured using same composition, color filter including same cured layer, and display device including same color filterSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 1966US7897502B2Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingersSTATS CHIPPAC LTD·Filed 2008·Granted Mar 1, 2011·1 cites·26 claims
- 2066US2023322983A1Curable composition, cured layer using the composition, color filter including the cured layer and display device including the color filterSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 2163US12308427B2Irreversible additive comprised in cathode material for secondary battery, cathode material comprising the same, and secondary battery comprising cathode materialLG ENERGY SOLUTION LTD·Filed 2020·Granted May 20, 2025·0 cites·8 claims
- 2263US8896133B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateSTATS CHIPPAC LTD·Filed 2013·Granted Nov 25, 2014·1 cites·25 claims
- 2362US2025019588A1Curable composition, cured layer prepared using the composition, color filter including the cured layer, and display device including the color filterSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 2461US2024400891A1Curable composition, cured film manufactured using composition, color filter including cured film, and display device including color filterSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 2560US12410365B2Solvent-free curable composition, cured film produced using same composition, color filter comprising same cured film, and display deviceSAMSUNG SDI CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·13 claims
- 2659US12351750B2Quantum dot, curable composition comprising the same, cured layer using the composition, and color filter including the cured layerSAMSUNG SDI CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·15 claims
- 2759US9524958B2Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Dec 20, 2016·1 cites·26 claims
- 2858US11866625B2Curable composition, cured layer using the same, and display device including cured layerSAMSUNG SDI CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·18 claims
- 2956US12365833B2Curable composition, cured film produced using same, and color filter comprising sameSAMSUNG SDI CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·15 claims
- 3056US8742566B2Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingersSTATS CHIPPAC LTD·Filed 2012·Granted Jun 3, 2014·0 cites·25 claims
- 3154US2023303917A1Curable composition, cured layer using the composition, color filter including the cured layer, and display device including the color filterSAMSUNG SDI CO LTD·Filed 2022·Application pending·0 cites
- 3252US8389398B2Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingersJANG KIYOUN·Filed 2012·Granted Mar 5, 2013·0 cites·19 claims
- 3351US12331234B2Quantum dot, curable composition comprising the same, cured layer using the composition, color filter including the cured layer, display device including the cured layer and method of manufacturing the cured layerSAMSUNG SDI CO LTD·Filed 2020·Granted Jun 17, 2025·0 cites·21 claims
- 3437US10915020B2Photosensitive resin composition, photosensitive resin layer using same and color filterSAMSUNG SDI CO LTD·Filed 2017·Granted Feb 9, 2021·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Yonghee Kang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →