Inventor · disambiguated record
Yoshio Kasai
Also filed as: KASAI YOSHIO
14 granted patents·5 pending applications·314 citations·filing 1984–2024
93Inventor score
Top patents by PatentIndex Score
19 records- 0194US5220672ALow power consuming digital circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 15, 1993·116 cites·10 claims
- 0278US5229650AUniterruptible power systemYUASA BATTERY CO LTD·Filed 1991·Granted Jul 20, 1993·93 cites·12 claims
- 0371US6959365B2Microcomputer including a flash memory and a flash memory rewrite program stored thereinRENESAS TECH CORP·Filed 2002·Granted Oct 25, 2005·19 cites·13 claims
- 0468US2025137983A1Atmospheric environment analysis systemKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0566US6717624B1Line memory in which reading of a preceding line from a first memory and writing of a current line to a second memory are performed in the same time periodRENESAS TECH CORP·Filed 2001·Granted Apr 6, 2004·8 cites·4 claims
- 0661US5156935ALead-acid batteryYUASA BATTERY CO LTD·Filed 1989·Granted Oct 20, 1992·26 cites·33 claims
- 0754US7045417B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted May 16, 2006·1 cites·19 claims
- 0854US6171977B1Semiconductor device applied to composite insulative film manufacturing method thereofTOSHIBA KK·Filed 1996·Granted Jan 9, 2001·17 cites·15 claims
- 0952US2008271989A1Apparatus for plating and method for controlling platingSHOJI FUMITO·Filed 2008·Application pending·0 cites
- 1042US4587072AMethod for shaping or molding stick cosmeticsPOLA CHEM IND INC·Filed 1984·Granted May 6, 1986·8 cites·1 claims
- 1140US5838056ASemiconductor device applied to composite insulative film and manufacturing method thereofTOSHIBA KK·Filed 1996·Granted Nov 17, 1998·7 cites·21 claims
- 1237US2011031576A1Solid-state imaging device and manufacturing method thereofTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1336US6757195B2Flash memory having enhanced yield and having enhanced reliability in redundant and dummy circuitsRENESAS TECH CORP·Filed 2002·Granted Jun 29, 2004·1 cites·3 claims
- 1436US5910674ASemiconductor integrated circuit device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jun 8, 1999·5 cites·2 claims
- 1535US2015255665A1Laser heating treatment method and method for manufacturing solid-state imaging deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 1632US2002017677A1Semiconductor device having laminated gate structure and method for manufacturing the semiconductor deviceFiled 2001·Application pending·0 cites
- 1731US5313600ASystem for controlling the number of data pieces in a queue memoryMITSUBISHI ELECTRIC CORP·Filed 1992·Granted May 17, 1994·5 cites·9 claims
- 1830US5714406AMethod for forming film on semiconductor substrate by thermal CVD methodTOSHIBA KK·Filed 1996·Granted Feb 3, 1998·0 cites·10 claims
- 1929US4664615AMethod and device for shaping or molding stick cosmeticsOHTOMO SEIYA·Filed 1985·Granted May 12, 1987·8 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →