Inventor · disambiguated record
Youji Kawasaki
Also filed as: KAWASAKI YOUJI
19 granted patents·5 pending applications·138 citations·filing 1994–2019
92Inventor score
Top patents by PatentIndex Score
24 records- 0192US10208183B2Curable composition, film, and method of producing filmCANON KK·Filed 2014·Granted Feb 19, 2019·7 cites·15 claims
- 0287US5514902ASemiconductor device having MOS transistorMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 7, 1996·96 cites·8 claims
- 0386US10023673B2Curable composition and cured product thereof, method for producing cured product, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic componentCANON KK·Filed 2015·Granted Jul 17, 2018·4 cites·31 claims
- 0481US10338467B2Method of producing filmCANON KK·Filed 2014·Granted Jul 2, 2019·3 cites·17 claims
- 0576US9957340B2Imprinting method and curable composition for imprintingCANON KK·Filed 2013·Granted May 1, 2018·2 cites·11 claims
- 0675US11332597B2Photo-curable composition and patterning method using the sameCANON KK·Filed 2019·Granted May 17, 2022·0 cites·16 claims
- 0772US10182500B2Curable composition for photoimprint, cured product, and method of producing film having pattern, optical component, circuit board, or electronic component using the compositionCANON KK·Filed 2015·Granted Jan 15, 2019·1 cites·24 claims
- 0865US9593170B2Compound, photocurable composition, and methods for producing patterned film, optical component, circuit board, electronic component by using the photocurable composition, and cured productCANON KK·Filed 2014·Granted Mar 14, 2017·1 cites·23 claims
- 0963US10450389B2Curable composition for photoimprint and method of producing film, optical component, circuit board, or electronic component using the compositionCANON KK·Filed 2014·Granted Oct 22, 2019·1 cites·30 claims
- 1061US10604609B2Curable composition and cured product thereof, method for producing cured product, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic componentCANON KK·Filed 2018·Granted Mar 31, 2020·0 cites·43 claims
- 1157US11231648B2Imprint device, imprint method, and method for manufacturing articleCANON KK·Filed 2019·Granted Jan 25, 2022·0 cites·8 claims
- 1256US6475887B1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Nov 5, 2002·19 cites·6 claims
- 1351US10386717B2Imprint method and apparatusCANON KK·Filed 2014·Granted Aug 20, 2019·0 cites·11 claims
- 1450US11163231B2Planarization apparatus, planarization method, and article manufacturing methodCANON KK·Filed 2019·Granted Nov 2, 2021·0 cites·16 claims
- 1550US10456974B2Photocurable composition, methods for producing film, optical component, circuit board, and electronic component by using the same, and cured productCANON KK·Filed 2014·Granted Oct 29, 2019·0 cites·5 claims
- 1646US11187978B2Planarization apparatusCANON KK·Filed 2019·Granted Nov 30, 2021·0 cites·14 claims
- 1746US9982102B2Photocurable composition and method of manufacturing film using the compositionCANON KK·Filed 2013·Granted May 29, 2018·0 cites·10 claims
- 1845US2016219717A1Method for forming a patterned film, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic componentCANON KK·Filed 2014·Application pending·0 cites
- 1940US2008198345A1Exposure apparatus and method of manufacturing deviceCANON KK·Filed 2008·Application pending·0 cites
- 2040US2008198347A1Immersion exposure apparatus and method of manufacturing deviceCANON KK·Filed 2008·Application pending·0 cites
- 2137US2017140922A1Generating method, imprinting method, imprint apparatus, program, and method of manufacturing articleCANON KK·Filed 2016·Application pending·0 cites
- 2234US2015360394A1Imprint apparatus, imprint method, method of manufacturing article, and supply apparatusCANON KK·Filed 2015·Application pending·0 cites
- 2333US6297113B1Method of manufacturing a semiconductor device, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 2, 2001·3 cites·14 claims
- 2430US5635752ASemiconductor device having source and drain regions which include horizontally extending secondary defect layersMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 3, 1997·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →