Inventor · disambiguated record
Yoshiki Kawazu
Also filed as: KAWAZU YOSHIKI
13 granted patents·5 pending applications·11 citations·filing 2012–2023
84Inventor score
Files withKYOCERA CORP18
Top patents by PatentIndex Score
18 records- 0177US12273990B2High-frequency board, high-frequency package, and high-frequency moduleKYOCERA CORP·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 0275US10068818B2Semiconductor element package, semiconductor device, and mounting structureKYOCERA CORP·Filed 2016·Granted Sep 4, 2018·3 cites·8 claims
- 0373US10051725B2Circuit board, electronic component housing package, and electronic deviceKYOCERA CORP·Filed 2014·Granted Aug 14, 2018·3 cites·8 claims
- 0469US9922925B2Electronic component housing package, and electronic device comprising sameKYOCERA CORP·Filed 2015·Granted Mar 20, 2018·2 cites·4 claims
- 0568US11758648B2High-frequency board, high-frequency package, and high-frequency moduleKYOCERA CORP·Filed 2021·Granted Sep 12, 2023·0 cites·17 claims
- 0664US9462709B2Element housing package and mounting structure bodyKYOCERA CORP·Filed 2013·Granted Oct 4, 2016·2 cites·10 claims
- 0758US9386687B2Electronic component housing package and electronic apparatusKYOCERA CORP·Filed 2012·Granted Jul 5, 2016·1 cites·6 claims
- 0854US2025142718A1Composite wiring board, electronic component accommodating package, and electronic deviceKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0953US2025056726A1Wiring board, electronic component mounting package using wiring board, and electronic moduleKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1053US2025151200A1Wiring board, electronic component mounting package using wiring board, and electronic moduleKYOCERA CORP·Filed 2023·Application pending·0 cites
- 1153US2024105600A1Wiring substrate, wiring structure using wiring substrate, electronic component mounting package, and electronic moduleKYOCERA CORP·Filed 2023·Application pending·0 cites
- 1252US11102880B2High-frequency board, high-frequency package, and high-frequency moduleKYOCERA CORP·Filed 2017·Granted Aug 24, 2021·0 cites·18 claims
- 1344US12293963B2Wiring substrate and electronic deviceKYOCERA CORP·Filed 2021·Granted May 6, 2025·0 cites·12 claims
- 1443US2024074035A1Wiring base and electronic deviceKYOCERA CORP·Filed 2021·Application pending·0 cites
- 1537US10869387B2High-frequency board, high-frequency package, and high-frequency moduleKYOCERA CORP·Filed 2017·Granted Dec 15, 2020·0 cites·12 claims
- 1637US10014233B2Electronic component containing package and electronic deviceKYOCERA CORP·Filed 2015·Granted Jul 3, 2018·0 cites·5 claims
- 1736US9805995B2Element-accommodating package and mounting structureKYOCERA CORP·Filed 2015·Granted Oct 31, 2017·0 cites·6 claims
- 1835US9935025B2Electronic component housing package and electronic deviceKYOCERA CORP·Filed 2015·Granted Apr 3, 2018·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →