Inventor · disambiguated record
Youngja Kim
Also filed as: KIM YOUNGJA
9 granted patents·11 pending applications·2 citations·filing 2013–2025
75Inventor score
Top patents by PatentIndex Score
20 records- 0169US12154882B2Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0268US12237297B2Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·19 claims
- 0368US8969646B2Ceramic ingot of spent filter having trapped radioactive cesium and method of preparing the sameKOREA ATOMIC ENERGY RES·Filed 2013·Granted Mar 3, 2015·2 cites·10 claims
- 0466US12420348B2Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0565US12341124B2Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0664US2025309185A1Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0763US2025167166A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0861US12334468B2Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·16 claims
- 0961US12318870B2Ball attachment apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1058US2025293185A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1158US2025174584A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1254US2024178181A1Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1353US2024170448A1Semiconductor package manufacturing method and a bonding device for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1452US12506110B2Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 1552US12208541B2Dicing blade including diamond particlesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 1652US2024145259A1Solder reflow apparatus and solder reflow methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1749US2024293884A1Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1848US2024355640A1Solder reflow apparatus and method of manufacturing electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1947US2024049400A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2044US2021111094A1Semiconductor package and semiconductor package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →