Inventor · disambiguated record
Younglyong Kim
Also filed as: KIM YOUNGLYONG
13 granted patents·13 pending applications·13 citations·filing 2013–2025
86Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD26
Top patents by PatentIndex Score
26 records- 0193US11164805B2Semiconductor package including non-conductive film between package substrate and semiconductor chip thereonSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·4 cites·20 claims
- 0287US12033973B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·19 claims
- 0386US11222882B2Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·2 cites·20 claims
- 0485US12237290B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 25, 2025·2 cites·20 claims
- 0585US11581234B2Semiconductor package with improved heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·19 claims
- 0684US11817443B2Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 14, 2023·1 cites·17 claims
- 0774US2025105217A1Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0866US12341074B2Semiconductor package with increased thermal dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
- 0966US11676875B2Semiconductor package including non-conductive film between package substrate and semiconductor chip thereonSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1063US12512446B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
- 1163US12166013B2Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 1262US2025167156A1Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1361US2025191991A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1461US2025022842A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1557US2024120319A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1655US2024079340A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1754US12476179B2Semiconductor package including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1854US2024063167A1Semiconductor package manufactured through a thermocompression process using a non-conductive film (ncf)SAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1952US2023154910A1Semiconductor chip, semiconductor package, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2051US2023144602A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2150US11488937B2Semiconductor package with stack structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 2250US2024021577A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2350US2024079349A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2449US2023005814A1Semiconductor package including heat sinksSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2542US8922007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·0 cites·19 claims
- 2641US2020402883A1Semiconductor packages having heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →