Inventor · disambiguated record
Yonghoon Kim
Also filed as: KIM YONGHOON
33 granted patents·10 pending applications·97 citations·filing 2009–2025
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD24KIM YONGHOON7FURUKAWA ELECTRIC CO LTD3SAMSUNG ELECTRO MECH2HONG JIN WON1
Top patents by PatentIndex Score
43 records- 0197US11682622B2Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·5 cites·14 claims
- 0294US8766429B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jul 1, 2014·28 cites·20 claims
- 0391US12058895B2Display device with reduced crosstalk and manufacturing method of the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Aug 6, 2024·3 cites·11 claims
- 0488US11217531B2Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·2 cites·19 claims
- 0585US10211190B2Semiconductor packages having reduced stressSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 19, 2019·5 cites·12 claims
- 0682US8330278B2Semiconductor package including a plurality of stacked semiconductor devicesLEE HEESEOK·Filed 2009·Granted Dec 11, 2012·13 cites·13 claims
- 0780US11101831B2RF signal transmission apparatus and control method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·14 claims
- 0879US9659852B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·19 claims
- 0978US10971451B2Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 6, 2021·2 cites·22 claims
- 1078US9105503B2Package-on-package deviceKIM YONGHOON·Filed 2013·Granted Aug 11, 2015·5 cites·19 claims
- 1178US8946892B2Semiconductor packageKIM YONGHOON·Filed 2011·Granted Feb 3, 2015·5 cites·20 claims
- 1278US8743560B2Circuit board and semiconductor module including the sameKIM YONGHOON·Filed 2011·Granted Jun 3, 2014·5 cites·18 claims
- 1377US8269342B2Semiconductor packages including heat slugsKIM YONGHOON·Filed 2010·Granted Sep 18, 2012·6 cites·17 claims
- 1476US9666517B2Semiconductor packages with a substrate between a pair of substratesKIM YONGHOON·Filed 2015·Granted May 30, 2017·3 cites·19 claims
- 1567US10756076B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·13 claims
- 1665US9355976B2Semiconductor memory chips and stack-type semiconductor packages including the sameKIM YONGHOON·Filed 2013·Granted May 31, 2016·2 cites·14 claims
- 1765US2025343569A1Device and method for controlling electrical characteristics of transceiverSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1864US11469148B2Semiconductor package having a redistribution layer for package-on-package structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 11, 2022·1 cites·18 claims
- 1961US8866310B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·10 claims
- 2059US9099326B2Stack-type semiconductor packageKIM YONGHOON·Filed 2013·Granted Aug 4, 2015·2 cites·20 claims
- 2156US2024172358A1Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 2256US2024249866A1Superconducting rectangular wire for superconducting coil, and superconducting coilFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 2354US12211642B2Superconducting coil, method for producing same, and superconducting rectangular wire for superconducting coilFURUKAWA ELECTRIC CO LTD·Filed 2020·Granted Jan 28, 2025·0 cites·20 claims
- 2454US11745623B2Vehicle and control method of adjusting preheating temperature of batteryHYUNDAI MOTOR CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·10 claims
- 2554US11709196B2Method and apparatus for detecting circuit defectsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·16 claims
- 2654US9041222B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·0 cites·10 claims
- 2753US2024298409A1Circuit board, manufacturing method thereof, and electronic component package including the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 2851US2023299480A1Apparatus and method for measuring strength of signalSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2950US11050495B2Electronic device including transceiver for calibrating I/Q imbalance in millimeter wave communication system and method of operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 3049US12413317B2Apparatus and method for error correction in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·12 claims
- 3149US12394893B2Method and apparatus for calibrating phased array antennaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·11 claims
- 3247US8466268B2Lactobacillus sp. JNU2116 with antimutagenic activityOH SEJONG·Filed 2010·Granted Jun 18, 2013·0 cites·6 claims
- 3347US2022230777A1Resin coated superconducting wire, superconducting coil, and shield coilFURUKAWA ELECTRIC CO LTD·Filed 2020·Application pending·0 cites
- 3447US2023378985A1Communication device and method for operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3545US11205631B2Semiconductor package including multiple semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·18 claims
- 3643US9560767B2Wiring boards and semiconductor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 31, 2017·0 cites·20 claims
- 3742US2015311267A1Pixel structure for active matrix display, and method for manufacturing sameKOREA ELECTRONICS TECHNOLOGY·Filed 2013·Application pending·0 cites
- 3839US11251882B2Device and method for calibrating phased array antennaSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 15, 2022·0 cites·20 claims
- 3938US2019386869A1Method and apparatus for calibrating mismatching between in-phase component and quadrature component in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4038US2013183907A1Beam compensation method and base station in a wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4137US9033346B2Gasket for vehicleHONG JIN WON·Filed 2012·Granted May 19, 2015·0 cites·3 claims
- 4236US9799591B2Semiconductor packages including thermal blocksSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·18 claims
- 4329US10553514B2Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the sameKIM KEUNG BEUM·Filed 2015·Granted Feb 4, 2020·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Yonghoon Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →