Inventor · disambiguated record
Yong Hoon Kim
Also filed as: KIM YONG · KIM YONG H · KIM YONG HOE · KIM YONG SEONG
128 granted patents·49 pending applications·905 citations·filing 1989–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD45SAMSUNG ELECTRO MECH31KIM YONG-HOON22HYUNDAI MOTOR CO LTD12FURUKAWA ELECTRIC CO LTD5
Top patents by PatentIndex Score
177 records- 0198US10881004B1Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 29, 2020·6 cites·20 claims
- 0297US8664751B2Semiconductor packageKIM YONG-HOON·Filed 2011·Granted Mar 4, 2014·34 cites·8 claims
- 0396US8872319B2Stacked package structure including insulating layer between two stacked packagesKIM YONG-HOON·Filed 2011·Granted Oct 28, 2014·32 cites·38 claims
- 0495US8587096B2Semiconductor device including shielding layer and fabrication method thereofKIM YONG-HOON·Filed 2011·Granted Nov 19, 2013·21 cites·29 claims
- 0593US7087843B2Multilayer insulated wire and transformer using the sameFURUKAWA ELECTRIC CO LTD·Filed 2003·Granted Aug 8, 2006·49 cites·12 claims
- 0693US7061582B2Exposure apparatus including micro mirror array and exposure method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 13, 2006·94 cites·12 claims
- 0793US6576374B1Mask blank and method of fabricating phase shift mask from the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 10, 2003·42 cites·14 claims
- 0892US9362235B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·12 cites·11 claims
- 0992US8921993B2Semiconductor package having EMI shielding function and heat dissipation functionSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 30, 2014·13 cites·20 claims
- 1091US10952319B1Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 16, 2021·3 cites·20 claims
- 1190US8873245B2Embedded chip-on-chip package and package-on-package comprising sameKIM YONG-HOON·Filed 2011·Granted Oct 28, 2014·10 cites·8 claims
- 1289US11638346B2Component package and printed circuit board for the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 25, 2023·2 cites·16 claims
- 1389US10903170B2Substrate having embedded interconnect structureSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 26, 2021·6 cites·31 claims
- 1489US5164429APolymer activation apparatusSTRANCO INC·Filed 1989·Granted Nov 17, 1992·65 cites·1 claims
- 1587US9520387B2Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 13, 2016·8 cites·14 claims
- 1686US10174727B2Intake air control apparatus for vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted Jan 8, 2019·3 cites·7 claims
- 1785US10541263B2Image sensor package having multi-level stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 21, 2020·4 cites·15 claims
- 1885US9634750B2Beamforming method and apparatus for serving multiple usersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 25, 2017·8 cites·15 claims
- 1985US9142478B2Semiconductor package stack having a heat slugKIM YONG-HOON·Filed 2013·Granted Sep 22, 2015·8 cites·20 claims
- 2084US11248566B2Exhaust gas recirculation coolerHYUNDAI MOTOR CO LTD·Filed 2019·Granted Feb 15, 2022·2 cites·9 claims
- 2184US10879294B2Image sensor package having multi-level stack structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 2283US11758655B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 12, 2023·1 cites·15 claims
- 2383US11576261B2Connection structure embedded substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 7, 2023·1 cites·31 claims
- 2483US11206736B1Connection substrate and interposer substrate including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 21, 2021·1 cites·20 claims
- 2583US9520373B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·4 cites·20 claims
- 2683US8513996B2Semiconductor memory apparatus and method for correcting duty thereofKIM YONG HOON·Filed 2011·Granted Aug 20, 2013·6 cites·23 claims
- 2783US7873822B2System comprising electronic device and external device storing boot code for booting systemSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 18, 2011·10 cites·28 claims
- 2883US5348664AProcess for disinfecting water by controlling oxidation/reduction potentialSTRANCO INC·Filed 1992·Granted Sep 20, 1994·78 cites·11 claims
- 2982US8680667B2Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elementsKWON HEUNG-KYU·Filed 2012·Granted Mar 25, 2014·5 cites·31 claims
- 3081US8291210B2Methods of booting application processors from external devicesKIM YONG-HOON·Filed 2011·Granted Oct 16, 2012·5 cites·18 claims
- 3180US5771075AAudio/video synchronizerLG ELECTRONICS INC·Filed 1995·Granted Jun 23, 1998·71 cites·4 claims
- 3279US5551949AInfrared massage deviceINTERPORT INT INC·Filed 1994·Granted Sep 3, 1996·57 cites·10 claims
- 3378US11076485B2Component mounted board and electronic device comprising the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·1 cites·20 claims
- 3478US9691691B2Semiconductor package with sidewall contacting bonding tapeSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 27, 2017·4 cites·14 claims
- 3578US8633579B2Multi-chip package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2011·Granted Jan 21, 2014·4 cites·14 claims
- 3677US9803054B2Highly functional polyamide polymer, spinning dope composition containing same, and molded product thereofWOOJUNG CHEM CO LTD·Filed 2014·Granted Oct 31, 2017·1 cites·12 claims
- 3777US8314160B2Thermoplastic resin foamMASUDA KOHJI·Filed 2005·Granted Nov 20, 2012·5 cites·17 claims
- 3876US11129280B2Electronic component-embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 21, 2021·1 cites·17 claims
- 3976US8884421B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·3 cites·10 claims
- 4076US8253228B2Package on package structureKIM YONG-HOON·Filed 2011·Granted Aug 28, 2012·4 cites·20 claims
- 4175US8791559B2Semiconductor package with package on package structureKIM YONG-HOON·Filed 2012·Granted Jul 29, 2014·4 cites·19 claims
- 4274US10853976B2Selective dynamic color management for user interface components of a media playerGOOGLE LLC·Filed 2018·Granted Dec 1, 2020·1 cites·21 claims
- 4373US10213753B2High-capacity polymer system and method of preparing polymeric mixturesUGSI CHEMICAL FEED INC·Filed 2018·Granted Feb 26, 2019·1 cites·20 claims
- 4472US7771819B2Multilayer insulated wire and transformer made using the sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Aug 10, 2010·5 cites·22 claims
- 4572US5284627APolymer activation apparatusSTRANCO INC·Filed 1992·Granted Feb 8, 1994·32 cites·11 claims
- 4671US2025266498A1Electrolyte for secondary battery and method for preparing sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 4771US2025335731A1Validation Of ObjectsGOOGLE LLC·Filed 2025·Application pending·0 cites
- 4871US2024194876A1Positive electrode additive for a lithium secondary battery, a method of manufacturing same, and a positive electrode for a lithium secondary battery including sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 4970US12361244B1Validation of objectsGOOGLE LLC·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 5070US12114428B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
Showing the top 50 of 177 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →