Inventor · disambiguated record
Young Lyong Kim
Also filed as: KIM YOUNG L · KIM YOUNG LYONG
42 granted patents·29 pending applications·124 citations·filing 2006–2025
97Inventor score
Top patents by PatentIndex Score
71 records- 0197US10658300B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 19, 2020·20 cites·18 claims
- 0293US10431547B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 1, 2019·9 cites·19 claims
- 0389US11257793B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 0489US10438899B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·5 cites·18 claims
- 0588US8970046B2Semiconductor packages and methods of forming the sameKIM YOUNG LYONG·Filed 2012·Granted Mar 3, 2015·10 cites·20 claims
- 0687US11462479B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 4, 2022·4 cites·19 claims
- 0784US10770446B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·4 cites·18 claims
- 0880US9281235B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 8, 2016·3 cites·15 claims
- 0980US8053881B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·10 cites·5 claims
- 1078US2025343191A1Semiconductor PackageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1177US12388024B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1277US9024448B2Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·4 cites·15 claims
- 1377US8884446B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·4 cites·19 claims
- 1476US10847447B2Semiconductor device having planarized passivation layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
- 1576US9299631B2Stack-type semiconductor packageJANG AE-NEE·Filed 2014·Granted Mar 29, 2016·4 cites·20 claims
- 1675US12476225B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·18 claims
- 1775US8354744B2Stacked semiconductor package having reduced heightSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 15, 2013·4 cites·20 claims
- 1874US2025054915A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1973US12100681B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 2073US11031347B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 2172US8815731B2Semiconductor package and method of fabricating the sameKIM YOUNG LYONG·Filed 2011·Granted Aug 26, 2014·5 cites·18 claims
- 2271USD582263SPackageMGA ENTERTAINMENT INC·Filed 2006·Granted Dec 9, 2008·19 cites·1 claims
- 2369US10804218B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·15 claims
- 2468US9159705B2Semiconductor chip connecting semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 13, 2015·2 cites·19 claims
- 2567US11817411B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 2666US11830853B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2766US9245816B2Semiconductor package and method of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2014·Granted Jan 26, 2016·2 cites·15 claims
- 2865US12033948B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 2965US11705430B2Semiconductor package including mold layer having curved cross-section shapeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·15 claims
- 3065US9570423B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·1 cites·18 claims
- 3165US9373574B2Semiconductor packages and methods of forming the sameJANG AE-NEE·Filed 2013·Granted Jun 21, 2016·2 cites·13 claims
- 3265US9312213B2Bump structures having an extensionCHO MOON GI·Filed 2013·Granted Apr 12, 2016·2 cites·31 claims
- 3364US12159858B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·16 claims
- 3464US12002786B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·9 claims
- 3564US2025210434A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3663US7745907B2Semiconductor package including connector disposed in troughholeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 29, 2010·2 cites·7 claims
- 3763US2025233110A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3862US12394738B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·19 claims
- 3962US11488894B2Semiconductor device having planarized passivation layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 4062US2025087603A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4161US2025096214A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4261US2025046745A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4360US7759795B2Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·15 claims
- 4460US2024234376A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4559US2024421000A1Semiconductor die, semiconductor package and substrate dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4658US12446237B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 4758US2024429202A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4857US12218100B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 4956US2024222230A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5055US10964670B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 30, 2021·0 cites·12 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →