Inventor · disambiguated record
Yoichi Kitamura
Also filed as: KITAMURA YOICHI
26 granted patents·1 pending application·173 citations·filing 1979–2020
96Inventor score
Files withTOYO SEIKAN KAISHA LTD13MITSUBISHI ELECTRIC CORP6HASHIMOTO MINORU1KAWAKAMI KENJI1KITAMURA YOICHI1
Top patents by PatentIndex Score
27 records- 0176US10714838B2Array antenna apparatus and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 14, 2020·4 cites·24 claims
- 0272US4296182ACan composed of electrolytically chromated steelTOYO SEIKAN KAISHA LTD·Filed 1979·Granted Oct 20, 1981·16 cites·4 claims
- 0367US11211710B2Array antenna apparatus and method for fabricating sameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 28, 2021·1 cites·19 claims
- 0465US4384657ASide seam-coated tin-free steel welded canTOYO SEIKAN KAISHA LTD·Filed 1981·Granted May 24, 1983·20 cites·9 claims
- 0563US8229387B2Even harmonic mixerKAWAKAMI KENJI·Filed 2007·Granted Jul 24, 2012·4 cites·8 claims
- 0662USD719472SMultifunction measuring instrumentRION CO·Filed 2013·Granted Dec 16, 2014·15 cites·1 claims
- 0761USD942201SVacuum flaskZOJIRUSHI CORP·Filed 2020·Granted Feb 1, 2022·2 cites·1 claims
- 0861US4916031ASurface-treated steel plate and bonded structure of metal materialTOYO SEIKAN KAISHA LTD·Filed 1988·Granted Apr 10, 1990·22 cites·11 claims
- 0959US7738263B2Circuit module and process for producing the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Jun 15, 2010·1 cites·2 claims
- 1058US8240037B2Process for producing a circuit moduleKITAMURA YOICHI·Filed 2009·Granted Aug 14, 2012·2 cites·2 claims
- 1156US8548416B2Semiconductor chip and radio frequency circuitSUZUKI TAKUYA·Filed 2007·Granted Oct 1, 2013·1 cites·3 claims
- 1256US4404447AMethod of manufacturing a welded can bodyTOYO SEIKAN KAISHA LTD·Filed 1981·Granted Sep 13, 1983·12 cites·10 claims
- 1353US4387830ASide seam-coated tinplate welded canTOYO SEIKAN KAISHA LTD·Filed 1981·Granted Jun 14, 1983·10 cites·8 claims
- 1451US6791439B2Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 14, 2004·4 cites·13 claims
- 1550US4701354AProcess for surface treatment of metal materialsTOYO SEIKAN KAISHA LTD·Filed 1985·Granted Oct 20, 1987·14 cites·8 claims
- 1643US4471883AWelded can and process for preparation thereofTOYO SEIKAN KAISHA LTD·Filed 1983·Granted Sep 18, 1984·6 cites·2 claims
- 1742US5536986ASpindle motorNAGANO NIDEC CORP·Filed 1994·Granted Jul 16, 1996·10 cites·3 claims
- 1841US4392582ARetortable bonded canTOYO SEIKAN KAISHA LTD·Filed 1981·Granted Jul 12, 1983·5 cites·1 claims
- 1939US2019139702A1Irreversible circuit element, irreversible circuit device, and method for manufacturing said element and deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 2037US4652715AMethod of making a welded can bodyTOYO SEIKAN KAISHA LTD·Filed 1985·Granted Mar 24, 1987·9 cites·10 claims
- 2136US10863625B2Flexible printed circuit board and joined bodyMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 8, 2020·0 cites·13 claims
- 2235US4650700AMethod for surface treatment of metal blanksTOYO SEIKAN KAISHA LTD·Filed 1985·Granted Mar 17, 1987·5 cites·13 claims
- 2335US4282981ABright welded seam can of tinplateTOYO SEIKAN KAISHA LTD·Filed 1980·Granted Aug 11, 1981·7 cites·4 claims
- 2434US8912453B2Electronic component packageHASHIMOTO MINORU·Filed 2010·Granted Dec 16, 2014·0 cites·6 claims
- 2532US7763315B2Process for preparing a metal coating material comprising condensation polymerized resin nanoparticlesSAKURANOMIYA CHEMICAL CO LTD·Filed 2004·Granted Jul 27, 2010·0 cites·4 claims
- 2630US4401874AMethod of welding tin-free steel canTOYO SEIKAN KAISHA LTD·Filed 1981·Granted Aug 30, 1983·2 cites·5 claims
- 2729US4409456AWelded can and process for preparation thereofTOYO SEIKAN KAISHA LTD·Filed 1981·Granted Oct 11, 1983·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →