Inventor · disambiguated record
Yoshifumi Kitayama
Also filed as: KITAYAMA YOSHIFUMI
18 granted patents·1 pending application·457 citations·filing 1982–2005
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD13MATSUSHITA ELECTRONICS CORP3BRIDGESTONE TIRE CO LTD2
Top patents by PatentIndex Score
19 records- 0186US5550408ASemiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1995·Granted Aug 27, 1996·98 cites·5 claims
- 0284US5436503ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1993·Granted Jul 25, 1995·72 cites·2 claims
- 0380US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 0480US5744382AMethod of packaging electronic chip component and method of bonding of electrode thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 28, 1998·55 cites·24 claims
- 0579US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 0672US5622590ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1995·Granted Apr 22, 1997·39 cites·14 claims
- 0769US5646439AElectronic chip component with passivation film and organic protective filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 8, 1997·33 cites·4 claims
- 0863US6332268B1Method and apparatus for packaging IC chip, and tape-shaped carrier to be used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 25, 2001·21 cites·38 claims
- 0958US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 1056US6370750B1Component affixing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 16, 2002·21 cites·6 claims
- 1151US5240170AMethod for bonding lead of IC component with electrodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Aug 31, 1993·20 cites·6 claims
- 1247US4447014ATire component assemblyBRIDGESTONE TIRE CO LTD·Filed 1982·Granted May 8, 1984·9 cites·1 claims
- 1342US5791484AAssembly of chip partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 11, 1998·10 cites·10 claims
- 1440US5012388AElectrode structure of a chip type electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Apr 30, 1991·4 cites·10 claims
- 1538US5116228AMethod for bump formation and its equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted May 26, 1992·8 cites·5 claims
- 1633US4676864ABonding method of semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Jun 30, 1987·3 cites·12 claims
- 1732US2002022968A1Recycling systemFiled 2001·Application pending·0 cites
- 1831US6455099B1Method and device for applying sealant to IC having bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 24, 2002·4 cites·5 claims
- 1930US4510011AStrip deforming apparatusBRIDGESTONE TIRE CO LTD·Filed 1983·Granted Apr 9, 1985·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →