Inventor · disambiguated record
Youngchan Ko
Also filed as: KO YOUNGCHAN
28 granted patents·19 pending applications·23 citations·filing 2019–2025
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD47
Top patents by PatentIndex Score
47 records- 0195US11581284B2Semiconductor package with under-bump metal structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·17 claims
- 0293US11626367B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·3 cites·13 claims
- 0392US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0490US12334445B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·1 cites·20 claims
- 0590US12261105B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0690US11784129B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·15 claims
- 0786US11916002B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 0886US11562966B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·1 cites·20 claims
- 0984US11569158B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 1081US12021020B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 1181US11387225B2Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·1 cites·13 claims
- 1279US12183665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1378US2025118646A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1477US2025279366A1Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1577US2024347468A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1676US11329014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·2 cites·16 claims
- 1775US12046562B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1874US12394708B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1974US2025062221A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2072US2025273637A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2168US12094817B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2268US12040297B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 2368US12002798B2Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·9 claims
- 2466US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 2566US2023075027A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2665US12327826B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 2764US11935847B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·18 claims
- 2862US2025192019A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2961US12159826B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·16 claims
- 3061US2025062240A1Semiconductor package with improved structural stabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3160US2025273577A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3260US2025192013A1Wiring substrate and semiconductor package including a substrate wiring patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3359US11508639B2System in package (SiP) semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 3459US2025192018A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3559US2025006696A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3658US12278191B2Semiconductor packages having wiring patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·19 claims
- 3755US2024063070A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3854US2024222280A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3954US2024014197A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4054US2024421034A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4154US2024021531A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4253US2023148143A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4351US11721620B2Fan-out type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·19 claims
- 4450US11398420B2Semiconductor package having core member and redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 4549US11804444B2Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 31, 2023·0 cites·19 claims
- 4649US2024055338A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4746US11538737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →