Inventor · disambiguated record
Yohei Kurashima
Also filed as: KURASHIMA YOHEI
5 granted patents·534 citations·filing 1994–2002
87Inventor score
Files withSEIKO EPSON CORP5
Top patents by PatentIndex Score
5 records- 0197US6608371B2Semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Aug 19, 2003·243 cites·37 claims
- 0296US6812549B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Nov 2, 2004·157 cites·1 claims
- 0390US5735451AMethod and apparatus for bonding using brazing materialSEIKO EPSON CORP·Filed 1994·Granted Apr 7, 1998·58 cites·58 claims
- 0485US6596634B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Jul 22, 2003·37 cites·16 claims
- 0580US6158648AMethod and apparatus for bonding using brazing materialSEIKO EPSON CORP·Filed 1998·Granted Dec 12, 2000·39 cites·37 claims
Join the waitlist — get patent alerts
Get an alert when Yohei Kurashima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →