Inventor · disambiguated record
Yoichiro Kurita
Also filed as: KURITA YOICHIRO
91 granted patents·24 pending applications·886 citations·filing 2001–2024
99Inventor score
Top patents by PatentIndex Score
115 records- 0199US7795721B2Semiconductor device and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Granted Sep 14, 2010·122 cites·30 claims
- 0298US9396998B2Semiconductor device having fan-in and fan-out redistribution layersTOSHIBA KK·Filed 2014·Granted Jul 19, 2016·62 cites·21 claims
- 0396US9406602B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·9 cites·10 claims
- 0496US8354340B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Jan 15, 2013·23 cites·21 claims
- 0596US8349649B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 8, 2013·26 cites·6 claims
- 0695US11791311B2Electronic deviceNAGASE & CO LTD·Filed 2021·Granted Oct 17, 2023·2 cites·19 claims
- 0795US10224318B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·6 cites·16 claims
- 0895US8633591B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 21, 2014·10 cites·10 claims
- 0995US8541874B2Semiconductor deviceKURITA YOICHIRO·Filed 2012·Granted Sep 24, 2013·14 cites·9 claims
- 1095US8207605B2Semiconductor device having a sealing resin and method of manufacturing the sameKURITA YOICHIRO·Filed 2010·Granted Jun 26, 2012·17 cites·19 claims
- 1195US8058165B2Semiconductor device and method of manufacturing the sameKAWANO MASAYA·Filed 2010·Granted Nov 15, 2011·17 cites·8 claims
- 1295US7800233B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Sep 21, 2010·32 cites·17 claims
- 1394US7598117B2Method for manufacturing semiconductor module using interconnection structureNEC ELECTRONICS CORP·Filed 2006·Granted Oct 6, 2009·26 cites·19 claims
- 1493US10566219B2Chip transfer member, chip transfer apparatus, and chip transfer methodTOSHIBA ELECTRONIC DEVICES & STORAGE CORP·Filed 2018·Granted Feb 18, 2020·8 cites·12 claims
- 1593US10128223B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2017·Granted Nov 13, 2018·8 cites·18 claims
- 1693US8975750B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 10, 2015·7 cites·18 claims
- 1793US8823174B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·7 cites·5 claims
- 1893US7034386B2Thin planar semiconductor device having electrodes on both surfaces and method of fabricating sameNEC CORP·Filed 2002·Granted Apr 25, 2006·64 cites·8 claims
- 1992US8039756B2Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Oct 18, 2011·20 cites·15 claims
- 2092US6930396B2Semiconductor device and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted Aug 16, 2005·81 cites·33 claims
- 2191US7556983B2Thin planar semiconductor device having electrodes on both surfaces and method of fabricating sameNEC CORP·Filed 2006·Granted Jul 7, 2009·16 cites·9 claims
- 2290US9728519B2Bonding method of semiconductor chip and bonding apparatus of semiconductor chipTOSHIBA KK·Filed 2015·Granted Aug 8, 2017·6 cites·18 claims
- 2390US8395269B2Method of stacking semiconductor chips including forming an interconnect member and a through electrodeKAWANO MASAYA·Filed 2010·Granted Mar 12, 2013·10 cites·25 claims
- 2490US7977158B2Manufacturing method for electronic devicesRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·6 cites·16 claims
- 2590US7791186B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Sep 7, 2010·17 cites·32 claims
- 2689US9847325B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·3 cites·16 claims
- 2789US8193033B2Semiconductor device having a sealing resin and method of manufacturing the sameKURITA YOICHIRO·Filed 2008·Granted Jun 5, 2012·11 cites·19 claims
- 2889US8035231B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 11, 2011·17 cites·4 claims
- 2989US7928001B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Apr 19, 2011·14 cites·8 claims
- 3088US10991673B2Electronic deviceTOSHIBA KK·Filed 2019·Granted Apr 27, 2021·3 cites·18 claims
- 3188US10096574B2Semiconductor device including protective film over a substrateTOSHIBA MEMORY CORP·Filed 2016·Granted Oct 9, 2018·6 cites·18 claims
- 3287US10497688B2Semiconductor device having stacked logic and memory chipsTOSHIBA MEMORY CORP·Filed 2018·Granted Dec 3, 2019·5 cites·19 claims
- 3385US7772032B2Manufacturing method for electronic devicesNEC ELECTRONICS CORP·Filed 2008·Granted Aug 10, 2010·6 cites·15 claims
- 3485US7622801B2Thin planar semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Nov 24, 2009·10 cites·15 claims
- 3584US12249593B2Electronic deviceNAGASE & CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·9 claims
- 3684US7880295B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2009·Granted Feb 1, 2011·9 cites·6 claims
- 3783US9595507B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Granted Mar 14, 2017·4 cites·7 claims
- 3883US9324699B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Apr 26, 2016·3 cites·15 claims
- 3982US8890305B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 18, 2014·3 cites·17 claims
- 4082US6822336B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Nov 23, 2004·31 cites·9 claims
- 4179US7931411B2Optical transmission apparatus to which optical cable is connectedRENESAS ELECTRONICS CORP·Filed 2009·Granted Apr 26, 2011·8 cites·12 claims
- 4279US7812457B2Semiconductor device and semiconductor wafer and a method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Oct 12, 2010·5 cites·13 claims
- 4379US7538022B2Method of manufacturing electronic circuit deviceNEC ELECTRONICS CORP·Filed 2006·Granted May 26, 2009·8 cites·20 claims
- 4478US7370786B2Bonding method and bonding apparatusNEC ELECTRONICS CORP·Filed 2005·Granted May 13, 2008·5 cites·9 claims
- 4577US8114766B1Method for manufacturing semiconductor deviceSOEJIMA KOJI·Filed 2009·Granted Feb 14, 2012·9 cites·17 claims
- 4676US10203460B2Optical semiconductor moduleTOSHIBA KK·Filed 2017·Granted Feb 12, 2019·2 cites·26 claims
- 4776US8456020B2Semiconductor package and method of manufacturing the sameKURITA YOICHIRO·Filed 2010·Granted Jun 4, 2013·4 cites·9 claims
- 4875US7656046B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 2, 2010·6 cites·20 claims
- 4974US7812446B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Oct 12, 2010·8 cites·17 claims
- 5074US7238548B2Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jul 3, 2007·17 cites·19 claims
Showing the top 50 of 115 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →