Inventor · disambiguated record
Young Hoon Kwak
Also filed as: KWAK YOUNG HOON
20 granted patents·25 pending applications·241 citations·filing 2010–2023
93Inventor score
Files withSAMSUNG ELECTRO MECH27KWAK YOUNG HOON4SAMSUNG ELECTRONICS CO LTD4KIM KWANG SOO3ELECTRONICS & TELECOMMUNICATIONS RES INST1
Top patents by PatentIndex Score
45 records- 0197US9881198B2Electronic device and method of registering fingerprint in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 30, 2018·90 cites·18 claims
- 0289USD719113SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 9, 2014·43 cites·1 claims
- 0389USD717253SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·44 cites·1 claims
- 0485USD719926SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 23, 2014·33 cites·1 claims
- 0582US8897011B2Heat dissipation system for power moduleKWAK YOUNG HOON·Filed 2012·Granted Nov 25, 2014·7 cites·18 claims
- 0678US8729692B2Power module packageKIM KWANG SOO·Filed 2012·Granted May 20, 2014·5 cites·16 claims
- 0777US9455207B2All-in-one power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 27, 2016·4 cites·9 claims
- 0877US9153514B2Power module packageSOHN YOUNG HO·Filed 2012·Granted Oct 6, 2015·5 cites·15 claims
- 0977US8598702B2Semiconductor packageKWAK YOUNG HOON·Filed 2012·Granted Dec 3, 2013·5 cites·17 claims
- 1072US8736077B2Semiconductor package substrateKIM JONG MAN·Filed 2011·Granted May 27, 2014·3 cites·10 claims
- 1168US11151350B2Electronic device and method of registering fingerprint in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·18 claims
- 1262US9153564B2Power module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 6, 2015·1 cites·10 claims
- 1361US8810014B2Semiconductor package including conductive member disposed between the heat dissipation member and the lead frameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 19, 2014·1 cites·11 claims
- 1460US10262181B2Electronic device and method of registering fingerprint in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 16, 2019·0 cites·26 claims
- 1559US10621407B2Electronic device and method of registering fingerprint in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·15 claims
- 1659US2025148140A1Method and apparatus for selecting positions of physical sensors and virtual sensorsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1758US2023097951A1Greenhouse-linked air conditioning system and air conditioning method using the sameUNIV SEOUL IND COOP FOUND·Filed 2022·Application pending·0 cites
- 1848US8866288B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 21, 2014·0 cites·11 claims
- 1947US9443818B2Power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 13, 2016·0 cites·10 claims
- 2046US8816515B2Semiconductor module having sliding case and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 26, 2014·0 cites·12 claims
- 2146US2011247658A1Apparatus and method for cleaning a camera moduleSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2245US2015270201A1Semiconductor module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2344US9466589B2Power module package including heat spreader and inductance coilSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 11, 2016·0 cites·17 claims
- 2444US2014117525A1Power module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2544US2013314870A1Heat dissipation system for power moduleKWAK YOUNG HOON·Filed 2012·Application pending·0 cites
- 2644US2015091146A1Power semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2744US2015156914A1Heat radiation system for power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2843US2015156909A1Power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2942US2014116670A1Heat sink and cooling system including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3042US2014124182A1Cooling system of power semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3142US2014285973A1Housing and power module having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3242US2014285972A1Housing and power module having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3341US2013026616A1Power device package module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3441US2014118961A1Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3541US2014000839A1Cooling apparatusSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3641US2013105956A1Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3741US2013270689A1Semiconductor package, semiconductor module, and mounting structure thereofKIM KWANG SOO·Filed 2012·Application pending·0 cites
- 3840US8796730B2Power semiconductor moduleLEE YOUNG KI·Filed 2011·Granted Aug 5, 2014·0 cites·12 claims
- 3940US2013062743A1Power module package and method for manufacturing the sameKIM KWANG SOO·Filed 2011·Application pending·0 cites
- 4040US2014014313A1Multi-stage heat sink, cooling system with the same and method for controlling the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4140US2013020111A1Substrate for power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 4238US2013112388A1Heat sinkKWAK YOUNG HOON·Filed 2012·Application pending·0 cites
- 4338US2013146259A1Heat sinkOH KYU HWAN·Filed 2012·Application pending·0 cites
- 4437US2013047369A1Air blower assemblyHEO YOUNG KEUN·Filed 2011·Application pending·0 cites
- 4534US2015349230A1Heat radiation sheet for board, manufacturing method thereof, and heat radiation boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →