Inventor · disambiguated record
Youngchul Kwon
Also filed as: KWON YOUNGCHUL
8 granted patents·4 pending applications·2 citations·filing 2020–2024
77Inventor score
Top patents by PatentIndex Score
12 records- 0182US11468851B2Organic light-emitting diode display device and driving method thereofLG DISPLAY CO LTD·Filed 2020·Granted Oct 11, 2022·2 cites·16 claims
- 0277US12487698B2Touch display device and display panelLG DISPLAY CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·22 claims
- 0376US12265673B2Touch display device and display panelLG DISPLAY CO LTD·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 0474US11934607B2Touch display device and display panelLG DISPLAY CO LTD·Filed 2023·Granted Mar 19, 2024·0 cites·17 claims
- 0572US12032778B2Touch display device and display panelLG DISPLAY CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·17 claims
- 0670US11630535B2Touch display device and display panelLG DISPLAY CO LTD·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 0756US2024290658A1Method of wafer dicing and manufacturing method of semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0856US2025216690A1Wafer processing apparatus and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0954US12512369B2Wafer dicing method and method of manufacturing semiconductor devices by using the wafer dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1053US2024157472A1Wafer processing apparatus and wafer dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1147US2021146476A1Stealth dicing apparatus and stealth dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1246US11883905B2Wafer processing apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 30, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →