Inventor · disambiguated record
You-Jin Kyung
Also filed as: KYUNG YOU-JIN
23 granted patents·3 pending applications·317 citations·filing 2001–2023
94Inventor score
Top patents by PatentIndex Score
26 records- 0197US7709153B2Multi-component composite film method for preparing the sameLG CHEMICAL LTD·Filed 2008·Granted May 4, 2010·48 cites·6 claims
- 0297US7470488B2Multi-component composite film method for preparing the sameLG CHEMICAL LTD·Filed 2001·Granted Dec 30, 2008·97 cites·6 claims
- 0397US7014948B2Electrochemical device using multicomponent composite membrane filmLG CHEMICAL LTD·Filed 2002·Granted Mar 21, 2006·121 cites·12 claims
- 0486US11527503B2Method for manufacturing semiconductor packageLG CHEMICAL LTD·Filed 2020·Granted Dec 13, 2022·2 cites·10 claims
- 0585US6830849B2High crystalline polypropylene microporous membrane, multi-component microporous membrane and methods for preparing the sameLG CHEMICAL LTD·Filed 2001·Granted Dec 14, 2004·22 cites·26 claims
- 0681US7087269B2Multi-component composite membrane and method for preparing the sameLG CHEMICAL LTD·Filed 2001·Granted Aug 8, 2006·20 cites·17 claims
- 0775US8617645B2Multi-component composite film method for preparing the sameLEE SEUNG-JIN·Filed 2008·Granted Dec 31, 2013·2 cites·15 claims
- 0874US9049778B2Polyamic acid, photosensitive resin composition, dry film and circuit boardKYUNG YOU-JIN·Filed 2012·Granted Jun 2, 2015·2 cites·18 claims
- 0969US8288656B2Low temperature curable photosensitive resin composition and dry film manufactured by using the sameLEE KWANG-JOO·Filed 2010·Granted Oct 16, 2012·2 cites·15 claims
- 1068US12448490B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2023·Granted Oct 21, 2025·0 cites·4 claims
- 1161US11515245B2Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the sameLG CHEMICAL LTD·Filed 2018·Granted Nov 29, 2022·0 cites·14 claims
- 1260US7491447B2Double-sided metallic laminate and method for manufacturing the sameLG CHEMICAL LTD·Filed 2004·Granted Feb 17, 2009·1 cites·17 claims
- 1357US11993731B2Adhesive composition for semiconductor circuit connection and adhesive film containing the sameLG CHEMICAL LTD·Filed 2020·Granted May 28, 2024·0 cites·8 claims
- 1455US12286564B2Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the sameLG CHEMICAL LTD·Filed 2020·Granted Apr 29, 2025·0 cites·12 claims
- 1553US12024654B2Non-conductive film and manufacturing method of semiconductor laminateLG CHEMICAL LTD·Filed 2020·Granted Jul 2, 2024·0 cites·13 claims
- 1651US11702520B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·6 claims
- 1751US10795259B2Photo-curable and heat-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2017·Granted Oct 6, 2020·0 cites·20 claims
- 1849US9410017B2Poly-amic acid, photo-sensitive resin composition, dry film, and circuit boardLG CHEMICAL LTD·Filed 2013·Granted Aug 9, 2016·0 cites·17 claims
- 1948US9778566B2Photocurable and thermocurable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2015·Granted Oct 3, 2017·0 cites·23 claims
- 2047US2011200939A1Polyamic acid, polyimide, photosensitive resin composition comprising the same and dry film manufactured by the sameLG CHEMICAL LTD·Filed 2010·Application pending·0 cites
- 2146US9788434B2Preparation method for dry film solder resist and film laminate used thereinLG CHEMICAL LTD·Filed 2014·Granted Oct 10, 2017·0 cites·16 claims
- 2245US8354219B2Photosensitive resin composition and dry film comprising the sameLG CHEMICAL LTD·Filed 2011·Granted Jan 15, 2013·0 cites·23 claims
- 2345US2012012366A1Polyamic acid, polyimide, photosensitive resin composition comprising the same, and dry film manufactured from the sameLEE KWANG-JOO·Filed 2011·Application pending·0 cites
- 2444US11361878B2Method for manufacturing insulating film and semiconductor packageLG CHEMICAL LTD·Filed 2018·Granted Jun 14, 2022·0 cites·17 claims
- 2543US8551687B2Alkali developable photosensitive resin composition and dry film manufactured by the sameLEE KWANG-JOO·Filed 2008·Granted Oct 8, 2013·0 cites·13 claims
- 2637US2004010062A1Polyimide copolymer and methods for preparing the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →