Inventor · disambiguated record
You-Cheng Lai
Also filed as: Lai you-cheng
4 granted patents·2 pending applications·5 citations·filing 2011–2025
60Inventor score
Top patents by PatentIndex Score
6 records- 0183US9812379B1Semiconductor package and manufacturing methodWIN SEMICONDUCTORS CORP·Filed 2016·Granted Nov 7, 2017·5 cites·16 claims
- 0266US2025217563A1Standard cell characterization for internal conductive line of cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0362US12282723B2Standard cell characterization for internal conductive line of cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0442US10256187B2Semiconductor device with slotted backside metal for improving Q factorWIN SEMICONDUCTORS CORP·Filed 2017·Granted Apr 9, 2019·0 cites·19 claims
- 0537US10665555B2Transition structure and high-frequency packageWIN SEMICONDUCTORS CORP·Filed 2018·Granted May 26, 2020·0 cites·12 claims
- 0635US2012086120A1Stacked semiconductor package having conductive vias and method for making the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →