Inventor · disambiguated record
Yong Je Lee
Also filed as: LEE YONG JE
10 granted patents·8 pending applications·23 citations·filing 2011–2024
84Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9HYPERCONNECT INC4HAN WON-GIL2ASSETPLUS INVESTMENT MAN CO LTD1LEE YONG-JE1
Top patents by PatentIndex Score
18 records- 0194US11496709B2Terminal, operating method thereof, and computer-readable recording mediumHYPERCONNECT INC·Filed 2021·Granted Nov 8, 2022·4 cites·19 claims
- 0283US10784244B2Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·13 claims
- 0383US10147706B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·4 cites·20 claims
- 0478US9252123B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·5 cites·8 claims
- 0571US2023150843A1Device and method for selectively removing perfluorinated compoundSK HYNIX INC·Filed 2022·Application pending·0 cites
- 0670US8245902B2Wire bonding apparatus and method using the sameLEE YONG-JE·Filed 2011·Granted Aug 21, 2012·5 cites·27 claims
- 0770US2023094732A1Terminal, Operating Method Thereof, and Computer-Readable Recording MediumHYPERCONNECT INC·Filed 2022·Application pending·0 cites
- 0862US2025063229A1Method and Apparatus for Providing Video Stream Based on Machine LearningHYPERCONNECT INC·Filed 2024·Application pending·0 cites
- 0954US12167088B2Method and apparatus for providing video stream based on machine learningHYPERCONNECT INC·Filed 2022·Granted Dec 10, 2024·0 cites·10 claims
- 1054US10679972B2Method of manufacturing multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·12 claims
- 1145US9652422B2Multi-bus systemSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 16, 2017·0 cites·10 claims
- 1244US9442788B2Bus protocol checker, system on chip including the same, bus protocol checking methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 13, 2016·0 cites·16 claims
- 1344US2023230952A1Wire clamp and wire bonding apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1443US10658326B2Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 1542US2021256611A1Apparatus and method for generating and validating customized investment portfoliosASSETPLUS INVESTMENT MAN CO LTD·Filed 2020·Application pending·0 cites
- 1639US2013093080A1Multi-chip package and method of manufacturing the sameHAN WON-GIL·Filed 2012·Application pending·0 cites
- 1733US2019157237A1Semiconductor devices having wire bonding structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1831US2012056178A1Multi-chip packagesHAN WON-GIL·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yong Je Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →