Inventor · disambiguated record
Yong-Bin Lee
Also filed as: LEE YONG B · LEE YONG-BIN
1 granted patent·6 pending applications·0 citations·filing 2006–2022
10Inventor score
Top patents by PatentIndex Score
7 records- 0146US2024349466A1ConverterLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 0244US2009133902A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0340US2009097220A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0438US2007298546A1Manufacturing method package substrateSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0537US2007170586A1Printed circuit board for semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0635US7592708B2Package board, semiconductor package, and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·0 cites·22 claims
- 0735US2007126126A1Solder bonding structure using bridge type patternSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →